PIC16C55-HS/P Microchip Technology, PIC16C55-HS/P Datasheet - Page 183

• Manufacturer Part Number: PIC16C55-HS/P
• Description: IC MCU OTP 512X12 28DIP
• Manufacturer: Microchip Technology
• Series: PIC® 16Cr

Specifications of PIC16C55-HS/P

• Core Size: 8-Bit
• Program Memory Size: 768B (512 x 12)
• Core Processor: PIC
• Speed: 20MHz
• Peripherals: POR, WDT
• Number Of I /o: 20
• Program Memory Type: OTP
• Ram Size: 24 x 8
• Voltage - Supply (vcc/vdd): 4.5 V ~ 5.5 V
• Oscillator Type: External
• Operating Temperature: 0°C ~ 70°C
• Package / Case: 28-DIP (0.600", 15.24mm)
• Controller Family/series: PIC16C
• No. Of I/o's: 20
• Ram Memory Size: 24Byte
• Cpu Speed: 20MHz
• No. Of Timers: 1
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• For Use With: XLT28XP - SOCKET TRANSITION ICE 28DIPAC164001 - MODULE SKT PROMATEII 18/28DIP
• Eeprom Size: -
• Data Converters: -
• Connectivity: -
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant, Lead free / RoHS Compliant

28-Lead Ceramic Dual In-line with Window (JW) – 600 mil (CERDIP)
2002 Microchip Technology Inc.
Number of Pins
Pitch
Top to Seating Plane
Ceramic Package Height
Standoff
Shoulder to Shoulder Width
Ceramic Pkg. Width
Overall Length
Tip to Seating Plane
Lead Thickness
Upper Lead Width
Lower Lead Width
Overall Row Spacing
Window Diameter
* Controlling Parameter
§ Significant Characteristic
JEDEC Equivalent: MO-103
Drawing No. C04-013
W
n
E1
eB
E
Dimension Limits
§
2
1
Units
A2
eB
A1
E1
B1
c
W
A
E
D
B
n
p
L
c
D
A1
A
MIN
1.430
Preliminary
.195
.155
.015
.595
.514
.125
.008
.050
.016
.610
.270
INCHES*
NOM
1.460
.100
.210
.160
.038
.600
.520
.138
.010
.058
.020
.660
.280
28
MAX
1.490
.225
.165
.060
.625
.526
.150
.012
.065
.023
.710
.290
B
B1
MIN
13.06
36.32
15.49
15.11
4.95
3.94
0.38
3.18
0.20
1.27
6.86
0.41
MILLIMETERS
NOM
15.24
37.08
16.76
13.21
PIC16C5X
2.54
5.33
4.06
0.95
3.49
0.25
1.46
p
0.51
7.11
28
A2
DS30453D-page 181
MAX
15.88
13.36
37.85
18.03
L
5.72
4.19
1.52
0.30
1.65
0.58
7.37
3.81