PIC16F84A-04/SO Microchip Technology, PIC16F84A-04/SO Datasheet - Page 29

• Manufacturer Part Number: PIC16F84A-04/SO
• Description: IC MCU FLASH 1KX14 EE 18SOIC
• Manufacturer: Microchip Technology
• Series: PIC® 16Fr

Specifications of PIC16F84A-04/SO

• Program Memory Type: FLASH
• Program Memory Size: 1.75KB (1K x 14)
• Package / Case: 18-SOIC (7.5mm Width)
• Core Processor: PIC
• Core Size: 8-Bit
• Speed: 4MHz
• Peripherals: POR, WDT
• Number Of I /o: 13
• Eeprom Size: 64 x 8
• Ram Size: 68 x 8
• Voltage - Supply (vcc/vdd): 4 V ~ 5.5 V
• Oscillator Type: External
• Operating Temperature: 0°C ~ 70°C
• Processor Series: PIC16F
• Core: PIC
• Data Bus Width: 8 bit
• Data Ram Size: 68 B
• Maximum Clock Frequency: 4 MHz
• Number Of Programmable I/os: 13
• Number Of Timers: 1
• Operating Supply Voltage: 2 V to 5.5 V
• Maximum Operating Temperature: + 70 C
• Mounting Style: SMD/SMT
• 3rd Party Development Tools: 52715-96, 52716-328, 52717-734
• Development Tools By Supplier: ICE2000
• Minimum Operating Temperature: 0 C
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• For Use With: XLT18SO-1 - SOCKET TRANSITION 18SOIC 300MILI3-DB16F84A - BOARD DAUGHTER ICEPIC3309-1075 - ADAPTER 18-SOIC TO 18-SOIC309-1011 - ADAPTER 18-SOIC TO 18-DIP309-1010 - ADAPTER 18-SOIC TO 18-DIPAC164010 - MODULE SKT PROMATEII DIP/SOIC
• Data Converters: -
• Connectivity: -
• Lead Free Status / Rohs Status: Lead free / RoHS Compliant

1.8
1997 Microchip Technology Inc.
Related Application Notes
This section lists application notes that are related to this section of the manual. These applica-
tion notes may not be written specifically for the PIC16CXXX Mid-Range MCU family (that is they
may be written for the Base-Line, or the High-End families), but the concepts are pertinent, and
could be used (with modification and possible limitations). The current application notes related
to an introduction to Microchip’s PICmicro MCUs are:
Title
A Comparison of Low End 8-bit Microcontrollers
PIC16C54A EMI Results
Continuous Improvement
Improving the Susceptibility of an Application to ESD
Plastic Packaging and the Effects of Surface Mount Soldering Techniques
Section 1. Introduction
Application Note #
DS31001A-page 1-17
AN520
AN577
AN503
AN595
AN598
1