PIC18F4455-I/PT Microchip Technology, PIC18F4455-I/PT Datasheet - Page 191
![IC PIC MCU FLASH 12KX16 44TQFP](/photos/6/82/68251/c04-076_pt_sml.jpg)
PIC18F4455-I/PT
Manufacturer Part Number
PIC18F4455-I/PT
Description
IC PIC MCU FLASH 12KX16 44TQFP
Manufacturer
Microchip Technology
Series
PIC® 18Fr
Datasheets
1.PIC16F616T-ISL.pdf
(8 pages)
2.PCM18XR1.pdf
(438 pages)
3.PIC18F2221-ISO.pdf
(46 pages)
4.PIC18F2455-ISO.pdf
(14 pages)
5.PIC18F2455-ISO.pdf
(8 pages)
6.PIC18F2455-ISO.pdf
(26 pages)
7.PIC18F4550-IP.pdf
(430 pages)
8.PIC18LF2455-ISO.pdf
(430 pages)
Specifications of PIC18F4455-I/PT
Program Memory Type
FLASH
Program Memory Size
24KB (12K x 16)
Package / Case
44-TQFP, 44-VQFP
Core Processor
PIC
Core Size
8-Bit
Speed
48MHz
Connectivity
I²C, SPI, UART/USART, USB
Peripherals
Brown-out Detect/Reset, HLVD, POR, PWM, WDT
Number Of I /o
35
Eeprom Size
256 x 8
Ram Size
2K x 8
Voltage - Supply (vcc/vdd)
4.2 V ~ 5.5 V
Data Converters
A/D 13x10b
Oscillator Type
Internal
Operating Temperature
-40°C ~ 85°C
Processor Series
PIC18F
Core
PIC
Data Bus Width
8 bit
Data Ram Size
24 KB
Interface Type
SPI, I2C, EAUSART
Maximum Clock Frequency
8 MHz
Number Of Programmable I/os
35
Number Of Timers
4
Operating Supply Voltage
2 V to 5.5 V
Maximum Operating Temperature
+ 85 C
Mounting Style
SMD/SMT
3rd Party Development Tools
52715-96, 52716-328, 52717-734, 52712-325, EWPIC18
Development Tools By Supplier
PG164130, DV164035, DV244005, DV164005, PG164120, ICE2000, ICE4000, DV164136, DM163025
Minimum Operating Temperature
- 40 C
On-chip Adc
10 bit
Package
44TQFP
Device Core
PIC
Family Name
PIC18
Maximum Speed
48 MHz
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
For Use With
XLT44PT3 - SOCKET TRAN ICE 44MQFP/TQFPI3-DB18F4550 - BOARD DAUGHTER ICEPIC3DM163025 - PIC DEM FULL SPEED USB DEMO BRDAC164305 - MODULE SKT FOR PM3 44TQFP444-1001 - DEMO BOARD FOR PICMICRO MCUAC164020 - MODULE SKT PROMATEII 44TQFP
Lead Free Status / Rohs Status
Lead free / RoHS Compliant
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Company:
Part Number:
PIC18F4455-I/PT
Manufacturer:
Microchip Technology
Quantity:
10 000
Part Number:
PIC18F4455-I/PT
Manufacturer:
MICROCH
Quantity:
20 000
- PIC16F616T-ISL PDF datasheet
- PCM18XR1 PDF datasheet #2
- PIC18F2221-ISO PDF datasheet #3
- PIC18F2455-ISO PDF datasheet #4
- PIC18F2455-ISO PDF datasheet #5
- PIC18F2455-ISO PDF datasheet #6
- PIC18F4550-IP PDF datasheet #7
- PIC18LF2455-ISO PDF datasheet #8
- Current page: 191 of 438
- Download datasheet (7Mb)
17.10 Overview of USB
This section presents some of the basic USB concepts
and useful information necessary to design a USB
device. Although much information is provided in this
section, there is a plethora of information provided
within the USB specifications and class specifications.
Thus, the reader is encouraged to refer to the USB
specifications for more information (www.usb.org). If
you are very familiar with the details of USB, then this
section serves as a basic, high-level refresher of USB.
17.10.1
USB device functionality is structured into a layered
framework graphically shown in Figure 17-13. Each
level is associated with a functional level within the
device. The highest layer, other than the device, is the
configuration. A device may have multiple configura-
tions. For example, a particular device may have
multiple power requirements based on Self-Power Only
or Bus Power Only modes.
For each configuration, there may be multiple
interfaces. Each interface could support a particular
mode of that configuration.
Below the interface is the endpoint(s). Data is directly
moved at this level. There can be as many as
16 bidirectional endpoints. Endpoint 0 is always a
control endpoint and by default, when the device is on
the bus, Endpoint 0 must be available to configure the
device.
17.10.2
Information communicated on the bus is grouped into
1 ms time slots, referred to as frames. Each frame can
contain many transactions to various devices and
endpoints. Figure 17-9 shows an example of a
transaction within a frame.
FIGURE 17-13:
© 2009 Microchip Technology Inc.
LAYERED FRAMEWORK
FRAMES
Endpoint
USB LAYERS
Interface
Endpoint
Endpoint
PIC18F2455/2550/4455/4550
Configuration
Device
17.10.3
There are four transfer types defined in the USB
specification.
• Isochronous: This type provides a transfer
• Bulk: This type of transfer method allows for large
• Interrupt: This type of transfer provides for
• Control: This type provides for device setup
While full-speed devices support all transfer types,
low-speed devices are limited to interrupt and control
transfers only.
17.10.4
Power is available from the Universal Serial Bus. The
USB specification defines the bus power requirements.
Devices may either be self-powered or bus powered.
Self-powered devices draw power from an external
source, while bus powered devices use power supplied
from the bus.
Endpoint
method for large amounts of data (up to
1023 bytes) with timely delivery ensured;
however, the data integrity is not ensured. This is
good for streaming applications where small data
loss is not critical, such as audio.
amounts of data to be transferred with ensured
data integrity; however, the delivery timeliness is
not ensured.
ensured timely delivery for small blocks of data,
plus data integrity is ensured.
control.
To other Configurations (if any)
Interface
TRANSFERS
POWER
Endpoint
To other Interfaces (if any)
DS39632E-page 189
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