PIC24HJ256GP210-I/PF Microchip Technology, PIC24HJ256GP210-I/PF Datasheet - Page 280

• Manufacturer Part Number: PIC24HJ256GP210-I/PF
• Description: IC PIC MCU FLASH 128KX16 100TQFP
• Manufacturer: Microchip Technology
• Series: PIC® 24Hr

Specifications of PIC24HJ256GP210-I/PF

• Program Memory Type: FLASH
• Program Memory Size: 256KB (85.5K x 24)
• Package / Case: 100-TQFP, 100-VQFP
• Core Processor: PIC
• Core Size: 16-Bit
• Speed: 40 MIPs
• Connectivity: I²C, IrDA, LIN, SPI, UART/USART
• Peripherals: Brown-out Detect/Reset, DMA, POR, PWM, WDT
• Number Of I /o: 85
• Ram Size: 16K x 8
• Voltage - Supply (vcc/vdd): 3 V ~ 3.6 V
• Data Converters: A/D 32x10b, 32x12b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 85°C
• Processor Series: PIC24HJ
• Core: PIC
• Data Bus Width: 16 bit
• Data Ram Size: 16 KB
• Interface Type: CAN/I2C/SPI/UART
• Maximum Clock Frequency: 40 MHz
• Number Of Programmable I/os: 85
• Number Of Timers: 13
• Maximum Operating Temperature: + 85 C
• Mounting Style: SMD/SMT
• 3rd Party Development Tools: 52713-733, 52714-737, 53276-922, EWDSPIC
• Development Tools By Supplier: PG164130, DV164035, DV244005, DV164005
• Minimum Operating Temperature: - 40 C
• On-chip Adc: 32-ch x 12-bit
• Controller Family/series: PIC24
• No. Of I/o's: 85
• Ram Memory Size: 16KB
• Cpu Speed: 40MIPS
• No. Of Timers: 13
• Embedded Interface Type: I2C, SPI, UART
• Rohs Compliant: Yes
• A/d Bit Size: 12 bit
• A/d Channels Available: 32
• Height: 1 mm
• Length: 14 mm
• Supply Voltage (max): 3.6 V
• Supply Voltage (min): 3 V
• Width: 14 mm
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• For Use With: 876-1004 - PIC24 BREAKOUT BOARDDM300024 - KIT DEMO DSPICDEM 1.1MA240012 - MODULE PLUG-IN PIC24H 100QFPDV164033 - KIT START EXPLORER 16 MPLAB ICD2DM240001 - BOARD DEMO PIC24/DSPIC33/PIC32AC164323 - MODULE SKT FOR 100TQFP
• Eeprom Size: -
• Lead Free Status / Rohs Status: Lead free / RoHS Compliant

PIC24HJXXXGPX06/X08/X10
Revision G (March 2008)
This revision includes minor typographical and
formatting changes throughout the data sheet text.
The major changes are referenced by their respective
section in the following table.
TABLE A-1:
DS70175H-page 278
Section 3.0 “Memory Organization”
Section 5.0 “Reset”
Section 7.0 “Direct Memory Access (DMA)” Updated the table cross-reference for Note 2 in the DMAxREQ
Section 8.0 “Oscillator Configuration”
Section 15.0 “Serial Peripheral Interface
(SPI)”
Section 16.0 “Inter-Integrated Circuit™
(I
Section 17.0 “Universal Asynchronous
Receiver Transmitter (UART)”
2
C™)”
Section Name
MAJOR SECTION UPDATES
Updated Change Notification Register Map table title to reflect
application with PIC24HJXXXGPX10 devices (Table 3-2).
Added Change Notification Register Map tables (Table 3-3 and
Table 3-4) for PIC24HJXXXGPX08 and PIC24HJXXXGPX06
devices, respectively.
Updated the bit range for AD1CON3 (ADCS<7:0>) in the ADC1
Register Map and added Note 1 (Table 3-15).
Updated the bit range for AD2CON3 (ADCS<7:0>) in the ADC2
Register Map (Table 3-16).
Updated the title in the ECAN1 Register Map When C1CTRL1.WIN
= 0 or 1 to reflect applicable devices (Table 3-18).
Updated the title in the ECAN1 Register Map When C1CTRL1.WIN
= 0 to reflect applicable devices (Table 3-19).
Updated the title in the ECAN1 Register Map When C1CTRL1.WIN
= 1 to reflect applicable devices (Table 3-20).
Updated the Reset value for C2FEN1 (FFFF) in the ECAN2 Register
Map When C2CTRL1.WIN = 0 or 1 (Table 3-21) and updated the
title to reflect applicable device.
Updated the title for the ECAN2 Register Map When C2CTRL1.WIN
= 0 to reflect applicable device (Table 3-22).
Updated the title for the ECAN2 Register Map When C2CTRL1.WIN
= 1 to reflect applicable device (Table 3-23).
Updated Reset value for TRISA (F6FF) in the PORTA Register Map
(Table 3-24).
Added POR and BOR references in Reset Flag Bit Operation
(Table 5-1).
register (Register 7-2).
Updated the third clock source item (External Clock) in
Section 8.1.1 “System Clock Sources”.
Removed redundant information, which is now available in the
related section in the “PIC24H Family Reference Manual”, while
retaining the SPI Module Block Diagram (Figure 15-1).
Removed sections 16.3 through 16.13, while retaining the I
Diagram (Figure 16-1) (redundant information, which is now
available in the related section in the “PIC24H Family Reference
Manual”).
Removed sections 17.1 through 17.7 (redundant information, which
is now available in the related section in the “PIC24H Family
Reference Manual”).
Update Description
© 2009 Microchip Technology Inc.
2
C Block