DSPIC30F5013-30I/PT Microchip Technology, DSPIC30F5013-30I/PT Datasheet - Page 131

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DSPIC30F5013-30I/PT

Manufacturer Part Number
DSPIC30F5013-30I/PT
Description
IC DSPIC MCU/DSP 66K 80TQFP
Manufacturer
Microchip Technology
Series
dsPIC™ 30Fr

Specifications of DSPIC30F5013-30I/PT

Core Processor
dsPIC
Core Size
16-Bit
Speed
30 MIPs
Connectivity
CAN, I²C, SPI, UART/USART
Peripherals
AC'97, Brown-out Detect/Reset, I²S, LVD, POR, PWM, WDT
Number Of I /o
68
Program Memory Size
66KB (22K x 24)
Program Memory Type
FLASH
Eeprom Size
1K x 8
Ram Size
4K x 8
Voltage - Supply (vcc/vdd)
2.5 V ~ 5.5 V
Data Converters
A/D 16x12b
Oscillator Type
Internal
Operating Temperature
-40°C ~ 85°C
Package / Case
80-TFQFP
Core Frequency
40MHz
Core Supply Voltage
5.5V
Embedded Interface Type
CAN, I2C, SPI, UART
No. Of I/o's
68
Flash Memory Size
66KB
Supply Voltage Range
2.5V To 5.5V
Package
80TQFP
Device Core
dsPIC
Family Name
dsPIC30
Maximum Speed
30 MHz
Operating Supply Voltage
2.5|3.3|5 V
Data Bus Width
16 Bit
Number Of Programmable I/os
68
Interface Type
CAN/I2C/SPI/UART
On-chip Adc
16-chx12-bit
Number Of Timers
5
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
For Use With
DM300024 - KIT DEMO DSPICDEM 1.1XLT80PT3 - SOCKET TRAN ICE 80MQFP/TQFPAC164320 - MODULE SKT MPLAB PM3 80TQFPDM300004-2 - BOARD DEMO DSPICDEM.NET 2DM300004-1 - BOARD DEMO DSPICDEM.NET 1AC30F007 - MODULE SKT FOR DSPIC30F 80TQFPDV164005 - KIT ICD2 SIMPLE SUIT W/USB CABLE
Lead Free Status / RoHS Status
Lead free / RoHS Compliant, Lead free / RoHS Compliant
Other names
DSPIC30F501330IPT

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
DSPIC30F5013-30I/PT
Manufacturer:
Microchip Technology
Quantity:
10 000
Figure 19-2
conversion rates above 100 ksps. The dsPIC30F5013
is shown as an example.
FIGURE 19-2:
The configuration procedures below give the required
setup values for the conversion speeds above 100
ksps.
19.7.1
The following configuration items are required to
achieve a 200 ksps conversion rate.
• Comply with conditions provided in
• Connect external V
• Set SSRC<2.0> = 111 in the ADCON1 register to
• Enable automatic sampling by setting the ASAM
• Write the SMPI<3.0> control bits in the ADCON2
© 2011 Microchip Technology Inc.
the recommended circuit shown in
enable the auto convert option.
control bit in the ADCON1 register.
register for the desired number of conversions
between interrupts.
C2
0.1 μF
R2
10
V
DD
V
DD
200 KSPS CONFIGURATION
GUIDELINE
depicts the recommended circuit for the
C1
0.01 μF
REF
ADC VOLTAGE REFERENCE SCHEMATIC
1
2
3
4
5
6
7
8
9
10
V
V
13
14
15
16
17
18
19
20
+ and V
SS
DD
R1
10
REF
- pins following
Figure
Table
V
DD
19-2.
dsPIC30F5013
19-2.
V
DD
Note 1: Ensure adequate bypass capacitors are provided on each V
V
DD
• Configure the ADC clock period to be:
• Configure the sampling time to be 1 T
The following figure shows the timing diagram of the
ADC running at 200 ksps. The T
tion with the guidelines described above allows a con-
version speed of 200 ksps. See
example.
by writing to the ADCS<5:0> control bits in the
ADCON3 register.
writing: SAMC<4:0> = 00001.
dsPIC30F5011/5013
(14 + 1) x 200,000
V
V
60
59
58
57
56
55
54
53
52
50
49
DD
47
46
45
44
43
42
41
SS
1
V
See Note 1:
DD
C8
1 μF
C5
1 μF
V
AV
= 334 ns
DD
AD
DD
Example 19-1
C7
0.1 μF
C4
0.1 μF
selection in conjunc-
DS70116J-page 131
V
AV
DD
AD
DD
C6
0.01 μF
C3
0.01 μF
by
DD
for code
V
AV
DD
pin.
DD

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