LPC1769FBD100,551 NXP Semiconductors, LPC1769FBD100,551 Datasheet - Page 48

IC ARM CORTEX MCU 512K 100-LQFP

LPC1769FBD100,551

Manufacturer Part Number
LPC1769FBD100,551
Description
IC ARM CORTEX MCU 512K 100-LQFP
Manufacturer
NXP Semiconductors
Series
LPC17xxr

Specifications of LPC1769FBD100,551

Program Memory Type
FLASH
Program Memory Size
512KB (512K x 8)
Package / Case
100-LQFP
Core Processor
ARM® Cortex-M3™
Core Size
32-Bit
Speed
120MHz
Connectivity
CAN, Ethernet, I²C, IrDA, Microwire, SPI, SSI, UART/USART, USB OTG
Peripherals
Brown-out Detect/Reset, DMA, I²S, Motor Control PWM, POR, PWM, WDT
Number Of I /o
70
Ram Size
64K x 8
Voltage - Supply (vcc/vdd)
2.4 V ~ 3.6 V
Data Converters
A/D 8x12b, D/A 1x10b
Oscillator Type
Internal
Operating Temperature
-40°C ~ 85°C
Processor Series
LPC17
Core
ARM Cortex M3
Data Bus Width
32 bit
Data Ram Size
64 KB
Interface Type
Ethernet, USB, OTG, CAN
Maximum Clock Frequency
120 MHz
Number Of Programmable I/os
70
Number Of Timers
4
Operating Supply Voltage
3.3 V
Maximum Operating Temperature
+ 85 C
Mounting Style
SMD/SMT
3rd Party Development Tools
MDK-ARM, RL-ARM, ULINK2, MCB1760, MCB1760U, MCB1760UME
Minimum Operating Temperature
- 40 C
On-chip Adc
12 bit, 8 Channel
On-chip Dac
10 bit
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
For Use With
622-1005 - USB IN-CIRCUIT PROG ARM7 LPC2K
Eeprom Size
-
Lead Free Status / Rohs Status
Lead free / RoHS Compliant
Other names
568-4966
935290522551

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
LPC1769FBD100,551
Manufacturer:
NXP Semiconductors
Quantity:
10 000
NXP Semiconductors
Table 11.
T
[1]
[2]
[3]
Table 12.
T
[1]
LPC1769_68_67_66_65_64_4
Product data sheet
Symbol
f
t
t
Symbol
common to input and output
t
t
t
t
output
t
input
t
t
SCL
f
SU;DAT
r
f
WH
WL
v(Q)
su(D)
h(D)
amb
amb
Parameters are valid over operating temperature range unless otherwise specified.
CCLK = PCLK = 20 MHz; I
Bus capacitance C
CCLK = 20 MHz; peripheral clock to the I
signal in the I
=
=
40
40
°
°
Dynamic characteristic: I
Dynamic characteristics: I
Parameter
rise time
fall time
pulse width HIGH
pulse width LOW
data output valid time
data input set-up time
data input hold time
C to +85
C to +85
2
11.5 I
11.6 I
S-bus specification.
Parameter
SCL clock frequency
fall time
data set-up time
b
°
°
C; V
in pF (50 pF), external pull-up resistance = 218 Ω.
C.
2
2
Fig 12. I
DD(3V3)
C-bus
S-bus interface (LPC1769/68/67/66/65 only)
2
C-bus interface configured in master mode.
over specified ranges.
2
C-bus pins clock timing
2
C-bus pins (Fast-mode Plus)
2
Conditions
on pins I2STX_CLK and
I2SRX_CLK
on pins I2STX_CLK and
I2SRX_CLK
on pin I2STX_SDA;
on pin I2STX_WS
on pin I2SRX_SDA
on pin I2SRX_SDA
2
SDA
SCL
S-bus interface pins
S-bus interface PCLK =
P
Rev. 04 — 1 February 2010
[1][2][3]
Conditions
-
S
CCLK
4
; I
LPC1769/68/67/66/65/64
[1]
[1]
[1]
[1]
[1]
[1]
[1]
[1]
2
S clock cycle time T
Min
-
-
0.495 × T
-
-
-
3.5
4.0
Min
-
-
50
32-bit ARM Cortex-M3 microcontroller
cy(clk)
cy(clk)
Typ
-
-
-
-
-
-
-
-
= 1600 ns, corresponds to the SCK
Typ
-
-
-
t
f
t
Max
35
35
-
0.505 × T
30
30
-
-
SU;DAT
002aae860
© NXP B.V. 2010. All rights reserved.
Max
1
45
-
cy(clk)
Unit
ns
ns
-
ns
ns
ns
ns
ns
48 of 66
Unit
MHz
ns
ns

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