MC56F8367VPYE Freescale Semiconductor, MC56F8367VPYE Datasheet - Page 24

IC DSP 16BIT 60MHZ 160-LQFP

MC56F8367VPYE

Manufacturer Part Number
MC56F8367VPYE
Description
IC DSP 16BIT 60MHZ 160-LQFP
Manufacturer
Freescale Semiconductor
Series
56F8xxxr
Datasheets

Specifications of MC56F8367VPYE

Core Processor
56800
Core Size
16-Bit
Speed
60MHz
Connectivity
CAN, EBI/EMI, SCI, SPI
Peripherals
POR, PWM, Temp Sensor, WDT
Number Of I /o
76
Program Memory Size
544KB (272K x 16)
Program Memory Type
FLASH
Ram Size
18K x 16
Voltage - Supply (vcc/vdd)
2.25 V ~ 3.6 V
Data Converters
A/D 16x12b
Oscillator Type
External
Operating Temperature
-40°C ~ 105°C
Package / Case
160-LQFP
Cpu Family
56F8xxx
Device Core Size
16b
Frequency (max)
60MHz
Interface Type
CAN/SCI/SPI
Total Internal Ram Size
36KB
# I/os (max)
76
Number Of Timers - General Purpose
4
Operating Supply Voltage (typ)
3.3V
Operating Supply Voltage (max)
3.6V
Operating Supply Voltage (min)
3V
On-chip Adc
4(4-chx12-bit)
Instruction Set Architecture
CISC
Operating Temp Range
-40C to 105C
Operating Temperature Classification
Industrial
Mounting
Surface Mount
Pin Count
160
Package Type
LQFP
Data Bus Width
16 bit
Processor Series
MC56F83xx
Core
56800E
Numeric And Arithmetic Format
Fixed-Point
Device Million Instructions Per Second
60 MIPs
Maximum Clock Frequency
60 MHz
Number Of Programmable I/os
76
Data Ram Size
36 KB
Operating Supply Voltage
3.3 V
Maximum Operating Temperature
+ 105 C
Mounting Style
SMD/SMT
Development Tools By Supplier
MC56F8367EVME
Minimum Operating Temperature
- 40 C
Package
160LQFP
Family Name
56F8xxx
Maximum Speed
60 MHz
Number Of Timers
4
For Use With
MC56F8367EVME - EVAL BOARD FOR MC56F83X
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Eeprom Size
-
Lead Free Status / Rohs Status
Compliant

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24
Table 2-2 Signal and Package Information for the 160-Pin LQFP and MBGA (Continued)
(GPIOF0)
(GPIOF1)
(GPIOF2)
(GPIOF3)
(GPIOF4)
(GPIOF5)
(GPIOF6)
(GPIOF7)
(GPIOF8)
Signal
Name
D10
D11
D12
D13
D14
D15
RD
D7
D8
D9
No.
149
150
151
152
153
Pin
28
29
30
32
52
Ball No.
C4
K1
K3
K2
K4
A5
A4
B5
A3
P5
Output
Output
Output
Input/
Input/
Type
56F8367 Technical Data, Rev. 8
disabled,
pull-up is
disabled,
pull-up is
output is
output is
In reset,
In reset,
enabled
enabled
During
Reset
State
Data Bus — D7 - D15 specify part of the data for external
program or data memory accesses.
Depending upon the state of the DRV bit in the EMI bus control
register (BCR), D7 - D15 are tri-stated when the external bus is
inactive.
Most designs will want to change the DRV state to DRV = 1 instead
of using the default setting.
Port F GPIO — These nine GPIO pins can be individually
programmed as input or output pins.
At reset, these pins default to Data Bus functionality.
To deactivate the internal pull-up resistor, clear the appropriate
GPIO bit in the GPIOF_PUR register.
Example: GPIOF0, clear bit 0 in the GPIOF_PUR register.
Read Enable — RD is asserted during external memory read
cycles. When RD is asserted low, pins D0 - D15 become inputs
and an external device is enabled onto the data bus. When RD is
deasserted high, the external data is latched inside the device.
When RD is asserted, it qualifies the A0 - A23, PS, DS, and CSn
pins. RD can be connected directly to the OE pin of a static RAM
or ROM.
Depending upon the state of the DRV bit in the EMI bus control
register (BCR), RD is tri-stated when the external bus is inactive.
Most designs will want to change the DRV state to DRV = 1 instead
of using the default setting.
To deactivate the internal pull-up resistor, set the CTRL bit in the
SIM_PUDR register.
Signal Description
Freescale Semiconductor
Preliminary

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