PIC16C622A-04I/SO Microchip Technology, PIC16C622A-04I/SO Datasheet - Page 116

IC MCU OTP 2KX14 COMP 18SOIC

PIC16C622A-04I/SO

Manufacturer Part Number
PIC16C622A-04I/SO
Description
IC MCU OTP 2KX14 COMP 18SOIC
Manufacturer
Microchip Technology
Series
PIC® 16Cr
Datasheets

Specifications of PIC16C622A-04I/SO

Program Memory Type
OTP
Program Memory Size
3.5KB (2K x 14)
Package / Case
18-SOIC (7.5mm Width)
Core Processor
PIC
Core Size
8-Bit
Speed
4MHz
Peripherals
Brown-out Detect/Reset, POR, WDT
Number Of I /o
13
Ram Size
128 x 8
Voltage - Supply (vcc/vdd)
2.5 V ~ 5.5 V
Oscillator Type
External
Operating Temperature
-40°C ~ 85°C
Processor Series
PIC16C
Core
PIC
Data Bus Width
8 bit
Data Ram Size
128 B
Maximum Clock Frequency
4 MHz
Number Of Programmable I/os
13
Number Of Timers
1
Operating Supply Voltage
3 V to 5.5 V
Maximum Operating Temperature
+ 85 C
Mounting Style
SMD/SMT
3rd Party Development Tools
52715-96, 52716-328, 52717-734
Development Tools By Supplier
ICE2000, DM163022
Minimum Operating Temperature
- 40 C
Data Rom Size
128 B
Height
2.31 mm
Length
11.53 mm
Supply Voltage (max)
6 V
Supply Voltage (min)
3 V
Width
7.49 mm
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Eeprom Size
-
Data Converters
-
Connectivity
-
Lead Free Status / Rohs Status
Lead free / RoHS Compliant

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
PIC16C622A-04I/SO
Manufacturer:
SHARP
Quantity:
1 567
Part Number:
PIC16C622A-04I/SO
Manufacturer:
MICROCHI
Quantity:
660
Part Number:
PIC16C622A-04I/SO
Manufacturer:
MICROCHIP/微芯
Quantity:
20 000
PIC16C62X
18-Lead Plastic Dual In-line (P) – 300 mil (PDIP)
DS30235J-page 114
Number of Pins
Pitch
Top to Seating Plane
Molded Package Thickness
Base to Seating Plane
Shoulder to Shoulder Width
Molded Package Width
Overall Length
Tip to Seating Plane
Lead Thickness
Upper Lead Width
Lower Lead Width
Overall Row Spacing
Mold Draft Angle Top
Mold Draft Angle Bottom
* Controlling Parameter
§ Significant Characteristic
Notes:
Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed
.010” (0.254mm) per side.
JEDEC Equivalent: MS-001
Drawing No. C04-007
n
β
E1
E
eB
Dimension Limits
2
1
§
D
c
Units
A2
eB
A1
E1
B1
A
E
D
B
n
p
L
c
α
β
MIN
A1
A
.140
.115
.015
.300
.240
.890
.125
.008
.045
.014
.310
5
5
INCHES*
NOM
.100
.155
.130
.313
.250
.898
.130
.012
.058
.018
.370
18
10
10
B
B1
MAX
.170
.145
.325
.260
.905
.135
.015
.070
.022
.430
15
15
MIN
22.61
3.56
2.92
0.38
7.62
6.10
3.18
0.20
1.14
0.36
7.87
5
5
MILLIMETERS
 2003 Microchip Technology Inc.
NOM
p
22.80
6.35
2.54
3.94
3.30
7.94
3.30
0.29
1.46
0.46
9.40
α
18
10
10
MAX
A2
L
22.99
10.92
4.32
3.68
8.26
6.60
3.43
0.38
1.78
0.56
15
15

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