PIC18F25K20-I/SP Microchip Technology, PIC18F25K20-I/SP Datasheet - Page 7

• Manufacturer Part Number: PIC18F25K20-I/SP
• Description: IC PIC MCU FLASH 16KX16 28-DIP
• Manufacturer: Microchip Technology
• Series: PIC® XLP™ 18Fr

Specifications of PIC18F25K20-I/SP

• Program Memory Type: FLASH
• Program Memory Size: 32KB (16K x 16)
• Package / Case: 28-DIP (0.300", 7.62mm)
• Core Processor: PIC
• Core Size: 8-Bit
• Speed: 64MHz
• Connectivity: I²C, SPI, UART/USART
• Peripherals: Brown-out Detect/Reset, HLVD, POR, PWM, WDT
• Number Of I /o: 24
• Eeprom Size: 256 x 8
• Ram Size: 1.5K x 8
• Voltage - Supply (vcc/vdd): 1.8 V ~ 3.6 V
• Data Converters: A/D 11x10b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 85°C
• Processor Series: PIC18F
• Core: PIC
• Data Bus Width: 8 bit
• Data Ram Size: 1.5 KB
• Interface Type: CCP/ECCP/EUSART/I2C/MSSP/SPI
• Maximum Clock Frequency: 64 MHz
• Number Of Programmable I/os: 25
• Number Of Timers: 4
• Maximum Operating Temperature: + 85 C
• Mounting Style: Through Hole
• 3rd Party Development Tools: 52715-96, 52716-328, 52717-734, 52712-325, EWPIC18
• Development Tools By Supplier: PG164130, DV164035, DV244005, DV164005, PG164120, DV164136
• Minimum Operating Temperature: - 40 C
• On-chip Adc: 11-ch x 10-bit
• Package: 28SPDIP
• Device Core: PIC
• Family Name: PIC18
• Maximum Speed: 64 MHz
• Operating Supply Voltage: 2.5|3.3 V
• A/d Bit Size: 10 bit
• A/d Channels Available: 11
• Height: 3.3 mm
• Length: 34.67 mm
• Supply Voltage (max): 3.6 V
• Supply Voltage (min): 1.8 V
• Width: 7.24 mm
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• For Use With: AC164112 - VOLTAGE LIMITER MPLAB ICD2 VPP
• Lead Free Status / Rohs Status: Lead free / RoHS Compliant

27. Module: PORTB
28. Module: ADC
© 2009 Microchip Technology Inc.
011 or 111
000
001, 010,
100, 101, or
110
ADCS<2:0>
• The potential for failures increases over the life
• The potential for failures is highest at low V
• The potential for failures depends on the set-
Setting a PORTB Interrupt-on-change enable bit of
the IOCB register while the corresponding PORTB
input is high will cause an RBIF interrupt.
Work around
Set the IOCB bits to the desired configuration then
read PORTB to clear the mismatch latches.
Finally, clear the RBIF bit before setting the RBIE
bit.
Affected Silicon Revisions
After extended stress the Most Significant bit
(MSb) of the ADC conversion result can become
stuck at ‘0’. Conversions resulting in code 511 or
less are still accurate, but conversions that
should result in codes greater than 511 are
instead pinned at 511.
The potential for failures is a function of several
factors:
of the part. No failures have ever been seen for
accelerated stress estimated to be equivalent
to 34 years at room temperature. The failure
rate after accelerated stress estimated to be
equivalent to 146 years at room temperature
can be as high as 10% for V
to failure will decrease as the operating temper-
ature increases.
and decreases as V
tings of the ADCW<2:0> and ACQT<2:0> bits
in ADCON2:
A4
X
A7
X
No Failures
Very Low
Probability
Moderate
Probability
ACQT<2:0> = 000
A9
X
DD
AB
X
increases.
DD
Low Probability
Low Probability
Moderate
Probability
= 1.8V. The time
ACQT<2:0> ≠ 000
DD
PIC18F24/25/44/45K20
1. Restrict the input voltage to less than 1/2 of the
2. Use manual acquisition time (ACQT<2:0> =
3. Use manual acquisition time (ACQT<2:0> =
Work around
ADC voltage reference so that the expected
result is always a code less than or equal to 511.
000) and use the ADC’s dedicated internal oscil-
lator
(ADCS<2:0>) = 011 or 111).
000) and put the part to Sleep after each
conversion.
Affected Silicon Revisions
A4
X
as
A7
X
the
A9
X
conversion
AB
X
clock
DS80366G-page 7
source