PIC16C63A-20I/SO Microchip Technology, PIC16C63A-20I/SO Datasheet - Page 162

• Manufacturer Part Number: PIC16C63A-20I/SO
• Description: IC MCU OTP 4KX14 PWM 28SOIC
• Manufacturer: Microchip Technology
• Series: PIC® 16Cr

Specifications of PIC16C63A-20I/SO

• Core Size: 8-Bit
• Program Memory Size: 7KB (4K x 14)
• Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
• Core Processor: PIC
• Speed: 20MHz
• Connectivity: I²C, SPI, UART/USART
• Number Of I /o: 22
• Program Memory Type: OTP
• Ram Size: 192 x 8
• Voltage - Supply (vcc/vdd): 4 V ~ 5.5 V
• Oscillator Type: External
• Operating Temperature: -40°C ~ 85°C
• Package / Case: 28-SOIC (7.5mm Width)
• Controller Family/series: PIC16C
• No. Of I/o's: 22
• Ram Memory Size: 192Byte
• Cpu Speed: 20MHz
• No. Of Timers: 3
• Package: 28SOIC W
• Device Core: PIC
• Family Name: PIC16
• Maximum Speed: 20 MHz
• Operating Supply Voltage: 5 V
• Data Bus Width: 8 Bit
• Number Of Programmable I/os: 22
• Interface Type: I2C/SPI/USART
• Number Of Timers: 3
• Processor Series: PIC16C
• Core: PIC
• Data Ram Size: 192 B
• Maximum Clock Frequency: 20 MHz
• Maximum Operating Temperature: + 85 C
• Mounting Style: SMD/SMT
• 3rd Party Development Tools: 52715-96, 52716-328, 52717-734
• Development Tools By Supplier: ICE2000, DM163022
• Minimum Operating Temperature: - 40 C
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• For Use With: XLT28SO-1 - SOCKET TRANSITION 28SOIC 300MIL309-1073 - ADAPTER 28-SOIC TO 28-SOIC309-1024 - ADAPTER 28-SOIC TO 28-DIP309-1023 - ADAPTER 28-SOIC TO 28-DIP
• Eeprom Size: -
• Data Converters: -
• Lead Free Status / Rohs Status: Details

PIC16C63A/65B/73B/74B
18.9
DS30605C-page 162
44-Lead Plastic Metric Quad Flatpack (PQ) 10x10x2 mm Body, 1.6/0.15 mm Lead
Form (MQFP)
Number of Pins
Pitch
Pins per Side
Overall Height
Molded Package Thickness
Standoff §
Foot Length
Footprint (Reference)
Foot Angle
Overall Width
Overall Length
Molded Package Width
Molded Package Length
Lead Thickness
Lead Width
Pin 1 Corner Chamfer
Mold Draft Angle Top
Mold Draft Angle Bottom
* Controlling Parameter
§ Significant Characteristic
Notes:
Dimensions D1 and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed
.010” (0.254mm) per side.
JEDEC Equivalent: MS-022
Drawing No. C04-071
B
c
p
#leads=n1
Dimension Limits
E1
E
Units
(F)
CH
A2
D1
A1
E1
n1
E
D
B
n
p
A
L
c
n
MIN
L
2
1
.079
.077
.002
.029
.510
.510
.390
.390
.005
.012
.025
D1 D
0
5
5
CH x 45
INCHES
NOM
A
.086
.080
.006
.035
.063
.520
.520
.394
.394
.007
.015
.035
.031
3.5
44
10
10
11
MAX
A1
(F)
.093
.083
.010
.530
.530
.398
.398
.009
.018
.045
.041
15
15
7
MIN
12.95
12.95
2.00
1.95
0.05
0.73
9.90
9.90
0.13
0.30
0.64
0
5
5
MILLIMETERS*
NOM
2000 Microchip Technology Inc.
13.20
13.20
10.00
10.00
0.15
0.80
2.18
2.03
0.88
1.60
0.18
0.38
0.89
3.5
44
10
10
11
A2
MAX
13.45
13.45
10.10
10.10
2.35
2.10
0.25
1.03
0.23
0.45
1.14
15
15
7