PIC16F874-04/P Microchip Technology, PIC16F874-04/P Datasheet - Page 193

IC MCU FLASH 4KX14 EE 40DIP

PIC16F874-04/P

Manufacturer Part Number
PIC16F874-04/P
Description
IC MCU FLASH 4KX14 EE 40DIP
Manufacturer
Microchip Technology
Series
PIC® 16Fr

Specifications of PIC16F874-04/P

Core Size
8-Bit
Program Memory Size
7KB (4K x 14)
Core Processor
PIC
Speed
4MHz
Connectivity
I²C, SPI, UART/USART
Peripherals
Brown-out Detect/Reset, POR, PWM, WDT
Number Of I /o
33
Program Memory Type
FLASH
Eeprom Size
128 x 8
Ram Size
192 x 8
Voltage - Supply (vcc/vdd)
4 V ~ 5.5 V
Data Converters
A/D 8x10b
Oscillator Type
External
Operating Temperature
0°C ~ 70°C
Package / Case
40-DIP (0.600", 15.24mm)
Controller Family/series
PIC16F
No. Of I/o's
33
Eeprom Memory Size
128Byte
Ram Memory Size
192Byte
Cpu Speed
4MHz
No. Of Timers
3
Processor Series
PIC16F
Core
PIC
Data Bus Width
8 bit
Data Ram Size
192 B
Interface Type
MSSP, PSP, USART
Maximum Clock Frequency
20 MHz
Number Of Programmable I/os
33
Number Of Timers
3
Operating Supply Voltage
2 V to 5.5 V
Maximum Operating Temperature
+ 70 C
Mounting Style
Through Hole
3rd Party Development Tools
52715-96, 52716-328, 52717-734
Development Tools By Supplier
PG164130, DV164035, DV244005, DV164005, PG164120, ICE2000, DM163022, DV164120
Minimum Operating Temperature
0 C
On-chip Adc
10 bit, 8 Channel
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
For Use With
444-1001 - DEMO BOARD FOR PICMICRO MCU
Lead Free Status / Rohs Status
 Details

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
PIC16F874-04/P
Manufacturer:
MICROCHIP
Quantity:
3 000
Part Number:
PIC16F874-04/PQ
Manufacturer:
MICROCHIP
Quantity:
9 100
Part Number:
PIC16F874-04/PQ
Manufacturer:
Microchip Technology
Quantity:
10 000
Part Number:
PIC16F874-04/PT
Manufacturer:
MICROCHIP
Quantity:
4 500
Part Number:
PIC16F874-04/PT
Manufacturer:
Microchip Technology
Quantity:
10 000
28-Lead Skinny Plastic Dual In-line (SP) – 300 mil (PDIP)
2001 Microchip Technology Inc.
Number of Pins
Pitch
Top to Seating Plane
Molded Package Thickness
Base to Seating Plane
Shoulder to Shoulder Width
Molded Package Width
Overall Length
Tip to Seating Plane
Lead Thickness
Upper Lead Width
Lower Lead Width
Overall Row Spacing
Mold Draft Angle Top
Mold Draft Angle Bottom
* Controlling Parameter
§ Significant Characteristic
Notes:
Dimension D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed
.010” (0.254mm) per side.
JEDEC Equivalent: MO-095
Drawing No. C04-070
n
eB
E1
E
2
1
Dimension Limits
c
D
§
A1
A
Units
A2
E1
B1
eB
A1
A
E
D
B
n
p
L
c
MIN
1.345
.140
.125
.015
.300
.275
.125
.008
.040
.016
.320
5
5
B
B1
INCHES*
NOM
1.365
.100
.150
.130
.310
.285
.130
.012
.053
.019
.350
28
10
10
MAX
1.385
.160
.135
.325
.295
.135
.015
.065
.022
.430
15
15
MIN
34.16
3.56
3.18
0.38
6.99
3.18
0.20
8.13
7.62
1.02
0.41
5
5
MILLIMETERS
PIC16F87X
p
NOM
34.67
2.54
3.30
7.87
7.24
3.30
0.29
1.33
0.48
8.89
3.81
28
10
10
DS30292C-page 191
A2
L
MAX
35.18
10.92
4.06
3.43
8.26
7.49
3.43
0.38
1.65
0.56
15
15

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