PIC18F2685-E/SO Microchip Technology, PIC18F2685-E/SO Datasheet - Page 461
![IC PIC MCU FLASH 48KX16 28SOIC](/photos/6/59/65909/150-28-soic_sml.jpg)
PIC18F2685-E/SO
Manufacturer Part Number
PIC18F2685-E/SO
Description
IC PIC MCU FLASH 48KX16 28SOIC
Manufacturer
Microchip Technology
Series
PIC® 18Fr
Datasheets
1.PCM18XT0.pdf
(484 pages)
2.PIC18F2221-ISO.pdf
(46 pages)
3.PIC18F2682-ISP.pdf
(6 pages)
4.PIC18F2682-ISP.pdf
(4 pages)
Specifications of PIC18F2685-E/SO
Core Size
8-Bit
Program Memory Size
96KB (48K x 16)
Oscillator Type
Internal
Core Processor
PIC
Speed
40MHz
Connectivity
CAN, I²C, SPI, UART/USART
Peripherals
Brown-out Detect/Reset, HLVD, POR, PWM, WDT
Number Of I /o
25
Program Memory Type
FLASH
Eeprom Size
1K x 8
Ram Size
3.25K x 8
Voltage - Supply (vcc/vdd)
4.2 V ~ 5.5 V
Data Converters
A/D 8x10b
Operating Temperature
-40°C ~ 125°C
Package / Case
28-SOIC (7.5mm Width)
Controller Family/series
PIC18
No. Of I/o's
28
Eeprom Memory Size
1024Byte
Ram Memory Size
3328Byte
Cpu Speed
40MHz
Processor Series
PIC18F
Core
PIC
Data Bus Width
8 bit
Data Ram Size
3.25 KB
Interface Type
EUSART, I2C, MSSP, SPI
Maximum Clock Frequency
40 MHz
Number Of Programmable I/os
28
Number Of Timers
4
Maximum Operating Temperature
+ 125 C
Mounting Style
SMD/SMT
3rd Party Development Tools
52715-96, 52716-328, 52717-734, 52712-325, EWPIC18
Development Tools By Supplier
PG164130, DV164035, DV244005, DV164005, PG164120, ICE2000, DV164136
Minimum Operating Temperature
- 40 C
On-chip Adc
10 bit, 8 Channel
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Lead Free Status / RoHS Status
Lead free / RoHS Compliant, Lead free / RoHS Compliant
- PCM18XT0 PDF datasheet
- PIC18F2221-ISO PDF datasheet #2
- PIC18F2682-ISP PDF datasheet #3
- PIC18F2682-ISP PDF datasheet #4
- Current page: 461 of 484
- Download datasheet (9Mb)
© 2009 Microchip Technology Inc.
40-Lead Plastic Dual In-Line (P) – 600 mil Body [PDIP]
Notes:
1. Pin 1 visual index feature may vary, but must be located within the hatched area.
2. § Significant Characteristic.
3. Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed .010" per side.
4. Dimensioning and tolerancing per ASME Y14.5M.
NOTE 1
A1
Note:
A
BSC: Basic Dimension. Theoretically exact value shown without tolerances.
N
For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
1 2 3
Number of Pins
Pitch
Top to Seating Plane
Molded Package Thickness
Base to Seating Plane
Shoulder to Shoulder Width
Molded Package Width
Overall Length
Tip to Seating Plane
Lead Thickness
Upper Lead Width
Lower Lead Width
Overall Row Spacing §
b
b1
D
PIC18F2682/2685/4682/4685
Dimension Limits
Units
A2
A1
E1
eB
b1
N
D
e
A
E
L
b
c
e
A2
1.980
.125
.015
.590
.485
.115
.008
.030
.014
MIN
E1
–
–
L
.100 BSC
INCHES
NOM
40
–
–
–
–
–
–
–
–
–
–
–
Microchip Technology Drawing C04-016B
eB
E
2.095
MAX
.250
.195
.625
.580
.200
.015
.070
.023
.700
–
DS39761C-page 461
c
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