PIC18F6621T-I/PT Microchip Technology, PIC18F6621T-I/PT Datasheet - Page 19
![IC PIC MCU FLASH 32KX16 64TQFP](/photos/6/81/68123/c04-066_pf_sml.jpg)
PIC18F6621T-I/PT
Manufacturer Part Number
PIC18F6621T-I/PT
Description
IC PIC MCU FLASH 32KX16 64TQFP
Manufacturer
Microchip Technology
Series
PIC® 18Fr
Datasheets
1.PIC16F616T-ISL.pdf
(8 pages)
2.PIC18F6525-IPT.pdf
(396 pages)
3.PIC18F6525-IPT.pdf
(8 pages)
4.PIC18F6525-IPT.pdf
(38 pages)
Specifications of PIC18F6621T-I/PT
Core Processor
PIC
Core Size
8-Bit
Speed
40MHz
Connectivity
I²C, SPI, UART/USART
Peripherals
Brown-out Detect/Reset, LVD, POR, PWM, WDT
Number Of I /o
53
Program Memory Size
64KB (32K x 16)
Program Memory Type
FLASH
Eeprom Size
1K x 8
Ram Size
3.75K x 8
Voltage - Supply (vcc/vdd)
4.2 V ~ 5.5 V
Data Converters
A/D 12x10b
Oscillator Type
External
Operating Temperature
-40°C ~ 85°C
Package / Case
64-TFQFP
Processor Series
PIC18F
Core
PIC
Data Bus Width
8 bit
Data Ram Size
3840 B
Interface Type
MSSP, SPI, I2C, EUSART
Maximum Clock Frequency
40 MHz
Number Of Programmable I/os
53
Number Of Timers
2 x 8 bit
Operating Supply Voltage
4.2 V to 5.5 V
Maximum Operating Temperature
+ 85 C
Mounting Style
SMD/SMT
3rd Party Development Tools
52715-96, 52716-328, 52717-734, 52712-325, EWPIC18
Development Tools By Supplier
PG164130, DV164035, DV244005, DV164005, PG164120, ICE2000, ICE4000, DV164136, DM183032
Minimum Operating Temperature
- 40 C
On-chip Adc
12 bit
Data Rom Size
1024 B
Height
1 mm
Length
10 mm
Supply Voltage (max)
5.5 V
Supply Voltage (min)
4.2 V
Width
10 mm
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Company:
Part Number:
PIC18F6621T-I/PT
Manufacturer:
Microchip Technology
Quantity:
10 000
3.4
The ID locations are programmed much like the code
memory, except that multi-panel writes must be dis-
abled. The single panel that will be written will auto-
matically be enabled, based on the value of the Table
Pointer. The ID registers are mapped in addresses
200000h through 200007h. These locations read out
normally even after code protection.
TABLE 3-7:
2003 Microchip Technology Inc.
Step 1: Direct access to config memory.
Step 2: Configure device for single panel writes.
Step 3: Direct access to code memory.
Step 4: Load write buffer. Panel will be automatically determined by address.
Command
0000
0000
0000
0000
0000
0000
0000
0000
1100
0000
0000
0000
0000
0000
0000
0000
0000
1101
1101
1101
1111
0000
4-bit
ID Location Programming
8E A6
8C A6
0E 3C
6E F8
0E 00
6E F7
0E 06
6E F6
00 00
8E A6
9C A6
0E 20
6E F8
0E 00
6E F7
0E 00
6E F6
<LSB><MSB>
<LSB><MSB>
<LSB><MSB>
<LSB><MSB>
00 00
WRITE ID SEQUENCE
Data Payload
BSF
BSF
MOVLW 3Ch
MOVWF TBLPTRU
MOVLW 00h
MOVWF TBLPTRH
MOVLW 06h
MOVWF TBLPTRL
Write 00h to 3C0006h to enable single panel writes.
BSF
BCF
MOVLW 20h
MOVWF TBLPTRU
MOVLW 00h
MOVWF TBLPTRH
MOVLW 00h
MOVWF TBLPTRL
Write 2 bytes and post-increment address by 2
Write 2 bytes and post-increment address by 2
Write 2 bytes and post-increment address by 2
Write 2 bytes and start programming
NOP - hold PGC high for time P9
EECON1, EEPGD
EECON1, CFGS
EECON1, EEPGD
EECON1, CFGS
Table 3-7 demonstrates the code sequence required to
write the ID locations.
In order to modify the ID locations, refer to the method-
ology described in Section 3.2.2, “Modifying Code
Memory”. As with code memory, the ID locations must
be erased before modified.
Note:
PIC18F6X2X/8X2X
Core Instruction
Even though multi-panel writes are dis-
abled, the user must still fill the 8-byte data
buffer for the panel.
DS30499B-page 19