PIC18F2585-I/SO Microchip Technology, PIC18F2585-I/SO Datasheet - Page 10

IC MCU FLASH 24KX16 28SOIC

PIC18F2585-I/SO

Manufacturer Part Number
PIC18F2585-I/SO
Description
IC MCU FLASH 24KX16 28SOIC
Manufacturer
Microchip Technology
Series
PIC® 18Fr

Specifications of PIC18F2585-I/SO

Core Size
8-Bit
Program Memory Size
48KB (24K x 16)
Core Processor
PIC
Speed
40MHz
Connectivity
CAN, I²C, SPI, UART/USART
Peripherals
Brown-out Detect/Reset, HLVD, POR, PWM, WDT
Number Of I /o
25
Program Memory Type
FLASH
Eeprom Size
1K x 8
Ram Size
3.25K x 8
Voltage - Supply (vcc/vdd)
4.2 V ~ 5.5 V
Data Converters
A/D 8x10b
Oscillator Type
Internal
Operating Temperature
-40°C ~ 85°C
Package / Case
28-SOIC (7.5mm Width)
Controller Family/series
PIC18
No. Of I/o's
25
Eeprom Memory Size
1024Byte
Ram Memory Size
3.25KB
Cpu Speed
40MHz
No. Of Timers
4
Processor Series
PIC18F
Core
PIC
Data Bus Width
8 bit
Data Ram Size
3.25 KB
Interface Type
I2C, SPI, EUSART
Maximum Clock Frequency
40 MHz
Number Of Programmable I/os
28
Number Of Timers
1 x 8
Operating Supply Voltage
4.2 V to 5.5 V
Maximum Operating Temperature
+ 85 C
Mounting Style
SMD/SMT
3rd Party Development Tools
52715-96, 52716-328, 52717-734, 52712-325, EWPIC18
Development Tools By Supplier
PG164130, DV164035, DV244005, DV164005, PG164120, ICE2000, ICE4000, DM163011, DV164136
Minimum Operating Temperature
- 40 C
On-chip Adc
8
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
For Use With
XLT28SO-1 - SOCKET TRANSITION 28SOIC 300MILI3-DB18F4680 - BOARD DAUGHTER ICEPIC3
Lead Free Status / Rohs Status
 Details

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
PIC18F2585-I/SO
Manufacturer:
DIODES
Quantity:
34 000
Part Number:
PIC18F2585-I/SO
Quantity:
2
PIC18F2585/2680/4585/4680
33. Module: ECAN™ Technology
EXAMPLE 6:
34. Module: 10-Bit Analog-to-Digital
DS80202G-page 10
If (RXBnOVFL == 1)
Under specific conditions, the TXBxSIDH register
of the pending message for transmission may be
corrupted. The following conditions must exist for
this event to occur:
1. A transmit message must be pending.
2. All of the receive buffers must be full and a
3. A receiver buffer must be made available
When the AD clock source is selected as 2 T
RC (when ADCS2:ADCS0 = 000 or x11), in
extremely rare cases, the E
Error) and E
exceed the data sheet specification at codes 511
and 512 only.
Work around
Select the AD clock source as 4 T
16 T
2 T
Date Codes that pertain to this issue:
All engineering and production devices.
OSC
received message is in the Message Assembly
Buffer (MAB).
(RXBxCON<RXFUL> set to ‘0’) when a Start-
of-Frame (SOF) is recognized on the CAN bus,
or on the instruction cycle prior to the SOF for
the TXBxSIDH corruption event to occur. The
timing of this event is crucial.
OSC
{
}
Temp_RXREG = RXBx; // Read receive buffer
If (MyFlag)
{
}
or RC.
, 32 T
Converter
If (TXREQ == 1)// Is a transmission pending?
{
}
TXREQ = 1;
MyFlag = 0;
DL
OSC
TXREQ = 0; // Clear transmit request
If (TXABT == 1)// Store transmission aborted status value
(Differential Linearity Error) may
or 64 T
MyFlag = 1;
// Has an overflow occurred?
OSC
// Was previous transmission aborted?
// Set transmit request
// Reset stored transmission aborted status
IL
and avoid selecting
(Integral Linearity
OSC
, 8 T
OSC
OSC
or
,
Work around
Ensure that a receive buffer overflow condition
does not occur, and/or ensure that a transmit
request is not pending, if a receive buffer overflow
condition does exist.
The pseudo-code segment in Example 6 is an
example of how to disable a pending transmission.
This code is for illustration purposes only.
Date Codes that pertain to this issue:
All engineering and production devices.
© 2007 Microchip Technology Inc.

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