ATMEGA645-16AU Atmel, ATMEGA645-16AU Datasheet - Page 3

IC AVR MCU FLASH 64K 64TQFP

ATMEGA645-16AU

Manufacturer Part Number
ATMEGA645-16AU
Description
IC AVR MCU FLASH 64K 64TQFP
Manufacturer
Atmel
Series
AVR® ATmegar
Datasheets

Specifications of ATMEGA645-16AU

Core Processor
AVR
Core Size
8-Bit
Speed
16MHz
Connectivity
SPI, UART/USART, USI
Peripherals
Brown-out Detect/Reset, POR, PWM, WDT
Number Of I /o
53
Program Memory Size
64KB (32K x 16)
Program Memory Type
FLASH
Eeprom Size
2K x 8
Ram Size
4K x 8
Voltage - Supply (vcc/vdd)
2.7 V ~ 5.5 V
Data Converters
A/D 8x10b
Oscillator Type
Internal
Operating Temperature
-40°C ~ 85°C
Package / Case
64-TQFP, 64-VQFP
Processor Series
ATMEGA64x
Core
AVR8
Data Bus Width
8 bit
Data Ram Size
4 KB
Interface Type
SPI, UART, USI
Maximum Clock Frequency
16 MHz
Number Of Programmable I/os
54
Number Of Timers
3
Operating Supply Voltage
2.7 V to 5.5 V
Maximum Operating Temperature
+ 85 C
Mounting Style
SMD/SMT
3rd Party Development Tools
EWAVR, EWAVR-BL
Development Tools By Supplier
ATAVRDRAGON, ATSTK500, ATSTK600, ATAVRISP2, ATAVRONEKIT
Minimum Operating Temperature
- 40 C
On-chip Adc
10 bit, 8 Channel
For Use With
ATSTK600-TQFP64 - STK600 SOCKET/ADAPTER 64-TQFP770-1007 - ISP 4PORT ATMEL AVR MCU SPI/JTAG770-1005 - ISP 4PORT FOR ATMEL AVR MCU JTAG770-1004 - ISP 4PORT FOR ATMEL AVR MCU SPIATAVRISP2 - PROGRAMMER AVR IN SYSTEM
Lead Free Status / RoHS Status
Lead free / RoHS Compliant

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Company
Part Number
Manufacturer
Quantity
Price
Part Number:
ATMEGA645-16AU
Manufacturer:
Atmel
Quantity:
10 000
Part Number:
ATMEGA645-16AU
Manufacturer:
ATMEL/爱特梅尔
Quantity:
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Part Number:
ATMEGA645-16AUR
Manufacturer:
Atmel
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Figure 1-2.
2570M–AVR–04/11
(USCK/SCL/PCINT4) PE4
(XCK/AIN0/PCINT2) PE2
(DI/SDA/PCINT5) PE5
(OC1A/PCINT13) PB5
(OC1B/PCINT14) PB6
(OC0A/PCINT12) PB4
(MOSI/PCINT10) PB2
(MISO/PCINT11) PB3
(CLKO/PCINT7) PE7
(AIN1/PCINT3) PE3
(RXD/PCINT0) PE0
(SCK/PCINT9) PB1
(TXD/PCINT1) PE1
(DO/PCINT6) PE6
(SS/PCINT8) PB0
Pinout ATmega325/645
DNC
Note:
10
11
12
14
15
16
13
1
2
3
4
5
6
7
8
9
The large center pad underneath the QFN/MLF packages is made of metal and internally con-
nected to GND. It should be soldered or glued to the board to ensure good mechanical stability. If
the center pad is left unconnected, the package might loosen from the board.
INDEX CORNER
ATmega325/645
ATmega325/3250/645/6450
39
38
35
34
33
48
47
46
45
44
43
42
41
40
37
36
PA3
PA4
PA5
PA6
PA7
PG2
PC7
PC6
PC5
PC4
PC3
PC2
PC1
PC0
PG1
PG0
3

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