DSPIC30F6014A-20E/PT Microchip Technology, DSPIC30F6014A-20E/PT Datasheet - Page 10

• Manufacturer Part Number: DSPIC30F6014A-20E/PT
• Description: IC DSPIC MCU/DSP 144K 80TQFP
• Manufacturer: Microchip Technology
• Series: dsPIC™ 30Fr

Specifications of DSPIC30F6014A-20E/PT

• Program Memory Type: FLASH
• Program Memory Size: 144KB (48K x 24)
• Package / Case: 80-TFQFP
• Core Processor: dsPIC
• Core Size: 16-Bit
• Speed: 20 MIPS
• Connectivity: CAN, I²C, SPI, UART/USART
• Peripherals: AC'97, Brown-out Detect/Reset, I²S, LVD, POR, PWM, WDT
• Number Of I /o: 68
• Eeprom Size: 4K x 8
• Ram Size: 8K x 8
• Voltage - Supply (vcc/vdd): 2.5 V ~ 5.5 V
• Data Converters: A/D 16x12b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 125°C
• Product: DSCs
• Data Bus Width: 16 bit
• Processor Series: DSPIC30F
• Core: dsPIC
• Maximum Clock Frequency: 20 MHz
• Number Of Programmable I/os: 68
• Data Ram Size: 8 KB
• Maximum Operating Temperature: + 125 C
• Mounting Style: SMD/SMT
• 3rd Party Development Tools: 52713-733, 52714-737, 53276-922, EWDSPIC
• Development Tools By Supplier: PG164130, DV164035, DV244005, DV164005, PG164120, ICE4000, DM240002, DM330011
• Minimum Operating Temperature: - 40 C
• Package: 80TQFP
• Device Core: dsPIC
• Family Name: dsPIC30
• Maximum Speed: 20 MHz
• Operating Supply Voltage: 3.3|5 V
• Interface Type: CAN/I2C/SPI/UART
• On-chip Adc: 16-chx12-bit
• Number Of Timers: 5
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• For Use With: DM300024 - KIT DEMO DSPICDEM 1.1XLT80PT3 - SOCKET TRAN ICE 80MQFP/TQFPAC164320 - MODULE SKT MPLAB PM3 80TQFPDM300004-2 - BOARD DEMO DSPICDEM.NET 2DM300004-1 - BOARD DEMO DSPICDEM.NET 1AC30F007 - MODULE SKT FOR DSPIC30F 80TQFP
• Lead Free Status / Rohs Status: Lead free / RoHS Compliant

dsPIC30F6011A/6012A/6013A/6014A
13. Module: CAN
14. Module: CPU
DS80457B-page 10
CAN Receive filters 3, 4 and 5 may not work for a
given combination of instruction cycle speed and
CAN bit time quanta.
Work around
Do not use CAN RX filters 3, 4 and 5. Instead, use
filters 0, 1 and 2.
Affected Silicon Revisions
Sequential MAC class instructions, which prefetch
data from Y data space using ±4 address modifica-
tion, will cause an address error trap. The trap
occurs only when all of the following conditions are
true:
1. Two sequential MAC class instructions (or a
2. Both instructions prefetch data from Y data
3. Neither of the instruction uses an accumulator
Work around
The problem described above can be avoided by
using any of the following methods:
1. Inserting any other instruction between the two
2. Adding an accumulator write-back (a dummy
3. Do not use the + = 4 or - = 4 address
4. Do not prefetch data from Y data space.
Affected Silicon Revisions
A2
A2
X
X
MAC class instruction executed in a REPEAT or
DO loop) that prefetch from Y data space.
space using the + = 4 or - = 4 address
modification.
write-back.
MAC class instructions.
write-back if needed) to either of the MAC class
instructions.
modification.
B0
B0
X
B1
B1
X
15. Module: CPU
16. Module: Output Compare
When a user executes a DISI #7, for example,
this will disable interrupts for 7 + 1 cycles (7 + the
DISI instruction itself). In this case, the DISI
instruction uses a counter which counts down from
7 to 0. The counter is loaded with 7 at the end of
the DISI instruction.
If the user code executes another DISI on the
instruction cycle where the DISI counter has
become zero, the new DISI count is loaded, but the
DISI state machine does not properly re-engage
and continue to disable interrupts. At this point, all
interrupts are enabled. The next time the suer code
executes a DISI instruction, the feature will act
normally and block interrupts.
In summary, it is only when a DISI execution is
coincident with the current DISI count = 0, that the
issue occurs. Executing a DISI instruction before
the DISI counter reaches zero will not produce
this error. In this case, the DISI counter is loaded
with the new value, and interrupts remain disabled
until the counter becomes zero.
Work around
When executing multiple DISI instructions within
the source code, make sure that subsequent DISI
instructions have at least one instruction cycle
between the time that the DISI counter
decrements to zero and the next DISI instruction.
Alternatively, make sure that subsequent DISI
instructions are called before the DISI counter
decrements to zero.
Affected Silicon Revisions
A glitch will be produced on an output compare pin
under the following conditions:
• The user software initially drives the I/O pin
• The output compare module is configured and
When these events occur, the output compare
module will drive the pin low for one instruction
cycle (T
Work around
None. However, the user may use a timer interrupt
and write to the associated PORT register to
control the pin manually.
Affected Silicon Revisions
A2
A2
X
high using the output compare module or a
write to the associated PORT register.
enabled to drive the pin low at some point in later
time (OCxCON = 0x0002 or OCxCON = 0x0003).
X
CY
B0
B0
) after the module is enabled.
B1
B1
© 2010 Microchip Technology Inc.