PIC32MX695F512L-80I/PT Microchip Technology, PIC32MX695F512L-80I/PT Datasheet - Page 44

• Manufacturer Part Number: PIC32MX695F512L-80I/PT
• Description: IC MCU 32BIT 512KB FLASH 100TQFP
• Manufacturer: Microchip Technology
• Series: PIC® 32MXr

Specifications of PIC32MX695F512L-80I/PT

• Core Size: 32-Bit
• Program Memory Size: 512KB (512K x 8)
• Core Processor: MIPS32® M4K™
• Speed: 80MHz
• Connectivity: Ethernet, I²C, SPI, UART/USART, USB OTG
• Peripherals: Brown-out Detect/Reset, DMA, POR, PWM, WDT
• Number Of I /o: 85
• Program Memory Type: FLASH
• Ram Size: 128K x 8
• Voltage - Supply (vcc/vdd): 2.3 V ~ 3.6 V
• Data Converters: A/D 16x10b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 85°C
• Package / Case: 100-TFQFP
• Controller Family/series: PIC32
• Ram Memory Size: 128KB
• Cpu Speed: 80MHz
• No. Of Timers: 5
• Interface: I2C, SPI, UART, USB
• No. Of Pwm Channels: 5
• Embedded Interface Type: I2C, SPI, UART, USB
• Rohs Compliant: Yes
• Processor Series: PIC32MX6xx
• Core: MIPS
• 3rd Party Development Tools: 52713-733, 52714-737
• Development Tools By Supplier: PG164130, DV164035, DV244005
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Eeprom Size: -
• Lead Free Status / Rohs Status: Details

PIC32MX5XX/6XX/7XX
2.8
Many MCUs have options for at least two oscillators: a
high-frequency primary oscillator and a low-frequency
secondary oscillator (refer to
Configuration”
The oscillator circuit should be placed on the same side
of the board as the device. Also, place the oscillator cir-
cuit close to the respective oscillator pins, not exceed-
ing one-half inch (12 mm) distance between them. The
load capacitors should be placed next to the oscillator
itself, on the same side of the board. Use a grounded
copper pour around the oscillator circuit to isolate them
from surrounding circuits. The grounded copper pour
should be routed directly to the MCU ground. Do not
run any signal traces or power traces inside the ground
pour. Also, if using a two-sided board, avoid any traces
on the other side of the board where the crystal is
placed. A suggested layout is illustrated in
FIGURE 2-3:
DS61156F-page 44
External Oscillator Pins
for details).
SUGGESTED OSCILLATOR
CIRCUIT PLACEMENT
Section 8.0 “Oscillator
Main Oscillator
Guard Trace
Secondary
Guard Ring
Oscillator
Figure
2-3.
2.9
If MPLAB ICD 2, ICD 3 or REAL ICE is selected as a
debugger, it automatically initializes all of the A/D input
pins (ANx) as “digital” pins by setting all bits in the
ADPCFG register.
The bits in this register that correspond to the A/D pins
that are initialized by MPLAB ICD 2, ICD 3 or REAL
ICE, must not be cleared by the user application
firmware; otherwise, communication errors will result
between the debugger and the device.
If your application needs to use certain A/D pins as
analog input pins during the debug session, the user
application must clear the corresponding bits in the
ADPCFG register during initialization of the ADC
module.
When MPLAB ICD 2, ICD 3 or REAL ICE is used as a
programmer, the user application firmware must cor-
rectly configure the ADPCFG register. Automatic initial-
ization of this register is only done during debugger
operation. Failure to correctly configure the register(s)
will result in all A/D pins being recognized as analog
input pins, resulting in the port value being read as a
logic ‘0’, which may affect user application functionality.
2.10
Unused I/O pins should not be allowed to float as
inputs. They can be configured as outputs and driven
to a logic-low state.
Alternatively, inputs can be reserved by connecting the
pin to V
the pin as an input.
SS
Configuration of Analog and
Digital Pins During ICSP
Operations
Unused I/Os
through a 1k to 10k resistor and configuring
© 2010 Microchip Technology Inc.