EP7312-IVZ Cirrus Logic Inc, EP7312-IVZ Datasheet - Page 49

• Manufacturer Part Number: EP7312-IVZ
• Description: IC ARM720T MCU 90/74MHZ 208-LQFP
• Manufacturer: Cirrus Logic Inc
• Series: EP7r

Specifications of EP7312-IVZ

• Core Size: 32-Bit
• Core Processor: ARM7
• Speed: 74MHz
• Connectivity: Codec, DAI, EBI/EMI, IrDA, Keypad, SPI/Microwire1, UART/USART
• Peripherals: LCD, LED, MaverickKey, PWM
• Number Of I /o: 27
• Program Memory Type: ROMless
• Ram Size: 56K x 8
• Voltage - Supply (vcc/vdd): 2.3 V ~ 2.7 V
• Oscillator Type: External
• Operating Temperature: -40°C ~ 85°C
• Package / Case: 208-LQFP
• Controller Family/series: (ARM7)
• No. Of I/o's: 27
• Ram Memory Size: 48KB
• Cpu Speed: 74MHz
• No. Of Timers: 2
• No. Of Pwm Channels: 2
• Digital Ic Case Style: LQFP
• Embedded Interface Type: SSI, UART
• Rohs Compliant: Yes
• Processor Series: EP73xx
• Core: ARM720T
• Data Bus Width: 32 bit
• 3rd Party Development Tools: MDK-ARM, RL-ARM, ULINK2
• Development Tools By Supplier: EDB7312
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• For Use With: 598-1209 - KIT DEVELOPMENT EP73XX ARM7
• Eeprom Size: -
• Program Memory Size: -
• Data Converters: -
• Lead Free Status / Rohs Status: Details
• Other names: 598-1135

256-Ball PBGA Ball Listing
The list is ordered by ball location.
DS508F1
Ball Location
A10
A11
A12
A13
A14
A15
A16
B10
B11
B12
B13
B14
B15
B16
C10
C11
C12
C13
A1
A2
A3
A4
A5
A6
A7
A8
A9
B1
B2
B3
B4
B5
B6
B7
B8
B9
C1
C2
C3
C4
C5
C6
C7
C8
C9
nMOE/nSDCAS
MOSCOUT
VDDCORE
nURESET
nSDCS[1]
SDQM[3]
VDDOSC
WAKEUP
EXPCLK
SDCLK
VDDIO
VDDIO
VDDIO
VDDIO
VDDIO
VDDIO
VDDIO
VDDIO
VDDIO
VDDIO
nCS[4]
nCS[1]
VSSIO
nCS[5]
nCS[3]
VSSIO
VSSIO
VSSIO
VSSIO
VSSIO
VSSIO
VSSIO
VSSIO
Name
DD[1]
DD[2]
CL[1]
D[0]
D[2]
A[3]
A[6]
D[1]
A[2]
A[4]
A[5]
M
Strength
Schmitt
Schmitt
1
1
2
2
1
1
1
1
2
1
1
1
1
1
1
1
2
1
1
1
1
†
Reset
State
©
High
High
High
High
High
Low
Low
Low
Low
Low
Low
Low
Low
Low
Low
Low
Low
Low
Low
Low
Table 22. 256-Ball PBGA Ball Listing
Copyright Cirrus Logic, Inc. 2005
(All Rights Reserved)
Oscillator power
Pad ground
Core power
Pad ground
Pad ground
Pad ground
Pad ground
Pad ground
Pad ground
Pad ground
Pad ground
Pad power
Pad power
Pad power
Pad power
Pad power
Pad power
Pad power
Pad power
Pad power
Pad power
Type
I/O
I/O
I/O
O
O
O
O
O
O
O
O
O
O
O
O
O
O
O
O
O
O
I
I
I
Digital I/O power, 3.3 V
Chip select 4
Chip select 1
SDRAM clock out
SDRAM byte lane mask
LCD serial display data
LCD AC bias drive
Digital I/O power, 3.3 V
Data I/O
Data I/O
System byte address
Digital I/O power, 3.3V
System byte address
Main oscillator out
Oscillator power in, 2.5 V
I/O ground
Chip select 5
Digital I/O power, 3.3 V
Chip select 3
ROM, expansion OP enable/SDRAM CAS control signal
Digital I/O power, 3.3 V
SDRAM chip select 1
LCD serial display data
LCD line clock
Digital core power, 2.5V
Data I/O
System byte address
System byte address
System byte address
System wake up input
Digital I/O power, 3.3 V
User reset input
Digital I/O power, 3.3V
Expansion clock input
I/O ground
Digital I/O power, 3.3 V
I/O ground
I/O ground
I/O ground
Digital I/O power, 3.3 V
I/O ground
I/O ground
I/O ground
Digital I/O power, 3.3 V
I/O ground
High-Performance, Low-Power System on Chip
Description
EP7312
49