STM32F103ZET6TR STMicroelectronics, STM32F103ZET6TR Datasheet - Page 99

MCU 32BIT ARM 512K FLASH 100-LQF

STM32F103ZET6TR

Manufacturer Part Number
STM32F103ZET6TR
Description
MCU 32BIT ARM 512K FLASH 100-LQF
Manufacturer
STMicroelectronics
Series
STM32r
Datasheets

Specifications of STM32F103ZET6TR

Core Processor
ARM® Cortex-M3™
Core Size
32-Bit
Speed
72MHz
Connectivity
CAN, I²C, IrDA, LIN, SPI, UART/USART, USB
Peripherals
DMA, Motor Control PWM, PDR, POR, PVD, PWM, Temp Sensor, WDT
Number Of I /o
112
Program Memory Size
512KB (512K x 8)
Program Memory Type
FLASH
Ram Size
64K x 8
Voltage - Supply (vcc/vdd)
2 V ~ 3.6 V
Data Converters
A/D 21x12b; D/A 2x12b
Oscillator Type
Internal
Operating Temperature
-40°C ~ 85°C
Package / Case
100-LQFP
Processor Series
STM32F103x
Core
ARM Cortex M3
Data Bus Width
32 bit
Data Ram Size
64 KB
Interface Type
CAN, I2C, SPI, USART
Maximum Clock Frequency
72 MHz
Number Of Programmable I/os
112
Number Of Timers
11
Operating Supply Voltage
2 V to 3.6 V
Maximum Operating Temperature
+ 85 C
Mounting Style
SMD/SMT
3rd Party Development Tools
EWARM, EWARM-BL, KSDK-STM32-PLUS, KSK-STM32F103ZE, MDK-ARM, RL-ARM, ULINK2
Minimum Operating Temperature
- 40 C
On-chip Adc
12 bit, 21 Channel
On-chip Dac
12 bit, 2 Channel
Cpu Family
STM32
Device Core
ARM Cortex-M3
Device Core Size
32b
Frequency (max)
72MHz
Total Internal Ram Size
64KB
# I/os (max)
112
Number Of Timers - General Purpose
8
Operating Supply Voltage (typ)
2.5/3.3V
Operating Supply Voltage (max)
3.6V
Operating Supply Voltage (min)
2V
Instruction Set Architecture
RISC
Operating Temp Range
-40C to 85C
Operating Temperature Classification
Industrial
Mounting
Surface Mount
Pin Count
144
Package Type
LQFP
For Use With
497-10030 - STARTER KIT FOR STM32497-8511 - KIT STARTER FOR STM32 512K FLASH497-6438 - BOARD EVALUTION FOR STM32 512K
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Eeprom Size
-
Lead Free Status / Rohs Status
 Details

Available stocks

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Part Number
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Price
Part Number:
STM32F103ZET6TR
Manufacturer:
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STM32F103ZET6TR
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STM32F103xC, STM32F103xD, STM32F103xE
Figure 52. I
1. Measurement points are done at CMOS levels: 0.3 × V
2. LSB transmit/receive of the previously transmitted byte. No LSB transmit/receive is sent before the first
Figure 53. I
1. Based on characterization, not tested in production.
2. LSB transmit/receive of the previously transmitted byte. No LSB transmit/receive is sent before the first
byte.
byte.
SD transmit
SD receive
SD transmit
SD receive
WS output
WS input
CPOL = 0
CPOL = 1
CPOL = 0
CPOL = 1
2
2
S slave timing diagram (Philips protocol)
S master timing diagram (Philips protocol)
t v(WS)
t su(WS)
t w(CKH)
t w(CKH)
LSB receive
Doc ID 14611 Rev 8
LSB transmit
LSB transmit
LSB receive
t su(SD_MR)
t su(SD_SR)
t c(CK)
t c(CK)
(2)
(2)
(2)
(2)
MSB receive
DD
MSB receive
MSB transmit
MSB transmit
and 0.7 × V
t w(CKL)
t w(CKL)
t f(CK)
(1)
DD
(1)
t h(SD_MR)
.
t v(SD_MT)
t v(SD_ST)
t h(SD_SR)
Bitn receive
Bitn transmit
Bitn transmit
Bitn receive
Electrical characteristics
t r(CK)
LSB receive
t h(WS)
t h(WS)
t h(SD_ST)
LSB transmit
LSB receive
t h(SD_MT)
LSB transmit
ai14884b
ai14881b
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