STR911FAW46X6 STMicroelectronics, STR911FAW46X6 Datasheet - Page 12

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STR911FAW46X6

Manufacturer Part Number
STR911FAW46X6
Description
MCU ARM9 1024KB FLASH 128LQFP
Manufacturer
STMicroelectronics
Series
STR9r
Datasheet

Specifications of STR911FAW46X6

Core Processor
ARM9
Core Size
32-Bit
Speed
96MHz
Connectivity
CAN, EBI/EMI, I²C, IrDA, Microwire, SPI, SSI, SSP, UART/USART, USB
Peripherals
Brown-out Detect/Reset, DMA, POR, PWM, WDT
Number Of I /o
80
Program Memory Size
1MB (1M x 8)
Program Memory Type
FLASH
Ram Size
96K x 8
Voltage - Supply (vcc/vdd)
1.65 V ~ 2 V
Data Converters
A/D 8x10b
Oscillator Type
Internal
Operating Temperature
-40°C ~ 85°C
Package / Case
128-LQFP
Processor Series
STR911x
Core
ARM966E-S
Data Bus Width
16 bit, 32 bit
Data Ram Size
96 KB
Interface Type
CAN, SPI, UART
Maximum Clock Frequency
96 MHz
Number Of Programmable I/os
80
Number Of Timers
4
Maximum Operating Temperature
+ 85 C
Mounting Style
SMD/SMT
3rd Party Development Tools
EWARM, EWARM-BL, MCBSTR9, MCBSTR9U, MCBSTR9UME, MDK-ARM, RL-ARM, ULINK2
Minimum Operating Temperature
- 40 C
On-chip Adc
10 bit, 8 Channel
For Use With
MCBSTR9UME - BOARD EVAL MCBSTR9 + ULINK-MEMCBSTR9U - BOARD EVAL MCBSTR9 + ULINK2MCBSTR9 - BOARD EVAL STM STR9 SERIES
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Eeprom Size
-
Lead Free Status / Rohs Status
 Details

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
STR911FAW46X6
Manufacturer:
ST
Quantity:
201
Part Number:
STR911FAW46X6
Manufacturer:
STMicroelectronics
Quantity:
10 000
Functional overview
3
3.1
3.2
3.3
3.4
3.4.1
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Functional overview
System-in-a-package (SiP)
The STR91xFA is a SiP device, comprised of two stacked die. One die is the ARM966E-S
CPU with peripheral interfaces and analog functions, and the other die is the burst Flash.
The two die are connected to each other by a custom high-speed 32-bit burst memory
interface and a serial JTAG test/programming interface.
Package choice
STR91xFA devices are available in 128-pin (14 x 14 mm) and 80-pin (12 x 12 mm) LQFP
and LFBGA144 (10 x 10 mm) packages. Refer to
list of available peripherals for each of the package choices.
ARM966E-S CPU core
The ARM966E-S core inherently has separate instruction and data memory interfaces
(Harvard architecture), allowing the CPU to simultaneously fetch an instruction, and read or
write a data item through two Tightly-Coupled Memory (TCM) interfaces as shown in
Figure
reduction in cycle count per instruction. In addition to this, a 5-stage pipeline is used to
increase the amount of operational parallelism, giving the most performance out of each
clock cycle.
Ten DSP-enhanced instruction extensions are supported by this core, including single-cycle
execution of 32x16 Multiply-Accumulate, saturating addition/subtraction, and count leading-
zeros.
The ARM966E-S core is binary compatible with 32-bit ARM7 code and 16-bit Thumb
Burst Flash memory interface
A burst Flash memory interface
(I-TCM) path of the ARM966E-S core. Also in this path is an 8-instruction Pre-Fetch Queue
(PFQ) and a 15-entry Branch Cache (BC), enabling the ARM966E-S core to perform up to
96 MIPS while executing code directly from Flash memory. This architecture provides high
performance levels without a costly instruction SRAM, instruction cache, or external
SDRAM. Eliminating the instruction cache also means interrupt latency is reduced and code
execution becomes more deterministic.
Pre-fetch queue (PFQ)
As the CPU core accesses sequential instructions through the I-TCM, the PFQ always looks
ahead and will pre-fetch instructions, taking advantage any idle bus cycles due to variable
length instructions. The PFQ will fetch 32-bits at a time from the burst Flash memory at a
rate of up to 96 MHz.
1. The result is streamlined CPU Load and Store operations and a significant
Doc ID 13495 Rev 6
(Figure
1) has been integrated into the Instruction TCM
Table 2: Device summary on page 11
STR91xFAxxx
®
code.
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