AD8512AR Analog Devices Inc, AD8512AR Datasheet - Page 19

• Manufacturer Part Number: AD8512AR
• Description: IC OPAMP JFET 8MHZ DUAL LN 8SOIC
• Manufacturer: Analog Devices Inc

Specifications of AD8512AR

• Slew Rate: 20 V/µs
• Mounting Type: Surface Mount
• Rohs Status: RoHS non-compliant
• Design Resources: Precision, Bipolar Configuration for the AD5546/56 DAC (CN0024) Precision, Bipolar, Configuration for AD5547/AD5557 DAC (CN0028)
• Amplifier Type: J-FET
• Number Of Circuits: 2
• Gain Bandwidth Product: 8MHz
• Current - Input Bias: 25pA
• Voltage - Input Offset: 100µV
• Current - Supply: 2.2mA
• Current - Output / Channel: 70mA
• Voltage - Supply, Single/dual (±): ±4.5 V ~ 18 V
• Operating Temperature: -40°C ~ 125°C
• Package / Case: 8-SOIC (3.9mm Width)
• No. Of Amplifiers: 2
• Bandwidth: 20MHz
• No. Of Pins: 8
• Operating Temperature Range: -40°C To +125°C
• Gain: 8dB
• Peak Reflow Compatible (260 C): No
• Output Type: -
• -3db Bandwidth: -
• Lead Free Status / RoHS Status: Contains lead / RoHS non-compliant

OUTLINE DIMENSIONS
COPLANARITY
0.25 (0.0098)
0.10 (0.0040)
0.10
CONTROLLING DIMENSIONS ARE IN MILLIMETERS; INCH DIMENSIONS
(IN PARENTHESES) ARE ROUNDED-OFF MILLIMETER EQUIVALENTS FOR
REFERENCE ONLY AND ARE NOT APPROPRIATE FOR USE IN DESIGN.
4.00 (0.1574)
3.80 (0.1497)
0.95
0.85
0.75
Figure 59. 8-Lead Standard Small Outline Package [SOIC_N]
0.15
0.00
COPLANARITY
3.20
3.00
2.80
PIN 1
SEATING
Figure 60. 8-Lead Mini Small Outline Package [MSOP]
PLANE
Dimensions shown in millimeters and (inches)
0.10
COMPLIANT TO JEDEC STANDARDS MS-012-A A
COMPLIANT TO JEDEC STANDARDS MO-187-AA
0.38
0.22
8
1
0.65 BSC
5.00 (0.1968)
4.80 (0.1890)
1.27 (0.0500)
1
8
3.20
3.00
2.80
Dimensions shown in millimeters
BSC
5
4
4
5
SEATING
PLANE
0.51 (0.0201)
0.31 (0.0122)
Narrow Body (R-8)
5.15
4.90
4.65
1.10 MAX
6.20 (0.2441)
5.80 (0.2284)
1.75 (0.0688)
1.35 (0.0532)
(RM-8)
0.23
0.08
0.25 (0.0098)
0.17 (0.0067)
8°
0°
8°
0°
0.50 (0.0196)
0.25 (0.0099)
1.27 (0.0500)
0.40 (0.0157)
0.80
0.60
0.40
45°
Rev. I | Page 19 of 20
COPLANARITY
1.05
1.00
0.80
0.25 (0.0098)
0.10 (0.0039)
0.10
4.50
4.40
4.30
PIN 1
4.00 (0.1575)
3.80 (0.1496)
Figure 61. 14-Lead Thin Shrink Small Outline Package [TSSOP]
Figure 62. 14-Lead Standard Small Outline Package [SOIC_N]
CONTROLLING DIMENSIONS ARE IN MILLIMETERS; INCH DIMENSIONS
(IN PARENTHESES) ARE ROUNDED-OFF MILLIMETER EQUIVALENTS FOR
REFERENCE ONLY AND ARE NOT APPROPRIATE FOR USE IN DESIGN.
0.15
0.05
14
1
BSC
0.65
COMPLIANT TO JEDEC STANDARDS MO-153-AB-1
Dimensions shown in millimeters and (inches)
14
1
1.27 (0.0500)
0.51 (0.0201)
0.31 (0.0122)
0.30
0.19
8.75 (0.3445)
8.55 (0.3366)
COMPLIANT TO JEDEC STANDARDS MS-012-AB
5.10
5.00
4.90
BSC
Dimensions shown in millimeters
8
7
SEATING
PLANE
8
7
Narrow Body (R-14)
AD8510/AD8512/AD8513
BSC
6.40
6.20 (0.2441)
5.80 (0.2283)
1.20
MAX
SEATING
PLANE
1.75 (0.0689)
1.35 (0.0531)
(RU-14)
COPLANARITY
0.20
0.09
0.10
0.25 (0.0098)
0.17 (0.0067)
8°
0°
8°
0°
0.50 (0.0197)
0.25 (0.0098)
1.27 (0.0500)
0.40 (0.0157)
45°
0.75
0.60
0.45