LM158J National Semiconductor, LM158J Datasheet - Page 24

IC OP AMP LOW PWR DUAL 8-CDIP

LM158J

Manufacturer Part Number
LM158J
Description
IC OP AMP LOW PWR DUAL 8-CDIP
Manufacturer
National Semiconductor
Datasheets

Specifications of LM158J

Amplifier Type
General Purpose
Number Of Circuits
2
Slew Rate
0.5 V/µs
Gain Bandwidth Product
1MHz
Current - Input Bias
45nA
Voltage - Input Offset
2000µV
Current - Supply
1mA
Current - Output / Channel
40mA
Voltage - Supply, Single/dual (±)
3 V ~ 32 V, ±1.5 V ~ 16 V
Operating Temperature
-55°C ~ 125°C
Mounting Type
Through Hole
Package / Case
8-CDIP (0.300", 7.62mm)
Bandwidth
1 MHz
Channel Separation
-120
Common Mode Rejection Ratio
85
Current, Input Bias
45 nA
Current, Input Offset
3 nA
Current, Output
40 mA
Current, Supply
0.5 mA
Number Of Amplifiers
Dual
Package Type
CDIP-8
Temperature, Operating, Range
-55 to +125 °C
Voltage, Gain
100 V/mV
Voltage, Input
-0.3 to +32 V
Voltage, Offset
2 mV
Voltage, Output, High
28 V
Voltage, Output, Low
5 mV
Voltage, Supply
5 V
Lead Free Status / RoHS Status
Contains lead / RoHS non-compliant
Output Type
-
-3db Bandwidth
-
Other names
*LM158J

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Physical Dimensions
inches (millimeters) unless otherwise noted (Continued)
NOTES: UNLESS OTHERWISE SPECIFIED
1. EPOXY COATING
2. 63Sn/37Pb EUTECTIC BUMP
3. RECOMMEND NON-SOLDER MASK DEFINED LANDING PAD.
4. PIN A1 IS ESTABLISHED BY LOWER LEFT CORNER WITH RESPECT TO TEXT ORIENTATION REMAINING PINS ARE NUMBERED
COUNTERCLOCKWISE.
5. XXX IN DRAWING NUMBER REPRESENTS PACKAGE SIZE VARIATION WHERE X
IS PACKAGE WIDTH, X
IS PACKAGE LENGTH AND X
IS
1
2
3
PACKAGE HEIGHT.
6. REFERENCE JEDEC REGISTRATION MO-211, VARIATION BC.
8-Bump micro SMD
NS Package Number BPA08AAB
X
= 1.285 X
= 1.285
X
= 0.850
1
2
3
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