MCP1801T-3302I/OT Microchip Technology, MCP1801T-3302I/OT Datasheet - Page 17

• Manufacturer Part Number: MCP1801T-3302I/OT
• Description: IC REG LDO 150MA 3.3V SOT23-5
• Manufacturer: Microchip Technology

Specifications of MCP1801T-3302I/OT

• Package / Case: SOT-23-5, SC-74A, SOT-25
• Regulator Topology: Positive Fixed
• Voltage - Output: 3.3V
• Voltage - Input: Up to 10V
• Voltage - Dropout (typical): 0.2V @ 100mA
• Number Of Regulators: 1
• Current - Output: 150mA (Min)
• Operating Temperature: -40°C ~ 85°C
• Mounting Type: Surface Mount
• Number Of Outputs: 1
• Polarity: Positive
• Input Voltage Max: 10 V
• Output Voltage: 3.3 V
• Output Type: Fixed
• Dropout Voltage (max): 0.09 V at 30 mA
• Output Current: 150 mA
• Line Regulation: 0.2 % / V
• Load Regulation: 50 mV
• Voltage Regulation Accuracy: 2 %
• Maximum Power Dissipation: 0.25 W
• Maximum Operating Temperature: + 85 C
• Mounting Style: SMD/SMT
• Minimum Operating Temperature: - 40 C
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Current - Limit (min): -
• Lead Free Status / Rohs Status: Lead free / RoHS Compliant
• Other names: MCP1801T-3302I/OT; MCP1801T-3302I/OTTR

6.0
6.1
The MCP1801 is most commonly used as a voltage
regulator. Its low quiescent current and low dropout
voltage make it ideal for many battery-powered
applications.
FIGURE 6-1:
6.1.1
6.2
6.2.1
The internal power dissipation of the MCP1801 is a
function of input voltage, output voltage, and output
current. The power dissipation, as a result of the
quiescent current draw, is so low, it is insignificant
(25.0 µA x V
calculate the internal power dissipation of the LDO.
EQUATION 6-1:
The maximum continuous operating temperature
specified for the MCP1801 is +85°C
internal junction temperature of the MCP1801, the total
internal power dissipation is multiplied by the thermal
 2010 Microchip Technology Inc.
I
50 mA
Where:
OUT
V
Input Voltage Range =
P
V
1.8V
V
OUT(MIN)
LDO
OUT
IN(MAX)
P
APPLICATION CIRCUITS AND
ISSUES
Typical Application
Power Calculations
LDO
Package Type =
V
=
V
IN
APPLICATION INPUT CONDITIONS
POWER DISSIPATION
IN
OUT

V
maximum =
). The following equation can be used to
C
1 µF Ceramic
IN MAX 
=
=
=
OUT
typical =

V
I
OUT
OUT
LDO Pass device internal power
dissipation
Maximum input voltage
LDO minimum output voltage
NC
MCP1801
Typical Application Circuit.

–
=
V
OUT MIN
SOT-23-5
2.4V to 5.0V
5.0V
1.8V
50 mA maximum
SHDN
GND
V

IN

 I
.

To estimate the
OUT MAX 
V
2.4V to 5.0V
C
1 µF
Ceramic
IN
IN


resistance from junction to ambient (R
resistance from junction to ambient for the SOT-23-5
pin package is estimated at 256°C/W.
EQUATION 6-2:
The maximum power dissipation capability for a
package can be calculated given the junction-to-
ambient thermal resistance and the maximum ambient
temperature for the application. The following equation
can be used to determine the package maximum
internal power dissipation.
EQUATION 6-3:
EQUATION 6-4:
Where:
Where:
Where:
P
T
T
T
T
P
P
D(MAX)
T
A(MAX)
J(RISE)
J(MAX)
J(MAX)
TOTAL
TOTAL
AMAX
R
R
R
T
JA
JA
JA
J MAX
P

D MAX
T

J RISE
=
=
=
=
=
=
=
=
=
=
=


=

Maximum continuous junction
temperature
Total device power dissipation
Thermal resistance from
junction to ambient
Maximum ambient temperature
Maximum device power
dissipation
Maximum continuous junction
temperature
Maximum ambient temperature
Thermal resistance from
junction to ambient
Rise in device junction
temperature over the ambient
temperature
Maximum device power
dissipation
Thermal resistance from
junction to ambient
=

P
TOTAL
=

---------------------------------------------------
T
P
J MAX

D MAX


MCP1801
R
R

–

JA
JA

T
A MAX
R
+
DS22051D-page 17

T
JA
JA
AMAX
). The thermal

