MC33275DT-5.0G ON Semiconductor, MC33275DT-5.0G Datasheet - Page 2

• Manufacturer Part Number: MC33275DT-5.0G
• Description: IC REG LDO 300MA 5V DPAK
• Manufacturer: ON Semiconductor

Specifications of MC33275DT-5.0G

• Regulator Topology: Positive Fixed
• Voltage - Output: 5V
• Voltage - Input: Up to 13V
• Voltage - Dropout (typical): 0.26V @ 300mA
• Number Of Regulators: 1
• Current - Output: 300mA (Max)
• Operating Temperature: -40°C ~ 125°C
• Mounting Type: Surface Mount
• Package / Case: TO-252-2, DPak (2 Leads + Tab), TO-252AA, SC-63
• Number Of Outputs: 1
• Polarity: Positive
• Input Voltage Max: 13 V
• Output Voltage: 5 V
• Output Type: Fixed
• Dropout Voltage (max): 0.1 V at 10 mA
• Output Current: 300 mA
• Line Regulation: 10 mV
• Load Regulation: 25 mV
• Voltage Regulation Accuracy: 1 %
• Maximum Operating Temperature: + 125 C
• Mounting Style: SMD/SMT
• Minimum Operating Temperature: - 40 C
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Current - Limit (min): -
• Lead Free Status / Rohs Status: Lead free / RoHS Compliant
• Other names: MC33275DT-5.0G; MC33275DT-5.0GOS

Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the
Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect
device reliability.
*“C’’ (“case’’) is defined as the solder−attach interface between the center of the exposed pad on the bottom of the package, and the board to
MAXIMUM RATINGS
which it is attached.
Input Voltage
Power Dissipation and Thermal Characteristics
T
Output Current
Maximum Junction Temperature
Operating Ambient Temperature Range
Storage Temperature Range
Electrostatic Discharge Sensitivity (ESD)
A
Maximum Power Dissipation
Case 318E (SOT−223) ST Suffix
Case 369A (DPAK−3) DT Suffix
Case 488AF (DFN−8, 4x4) MN Suffix
Human Body Model (HBM)
Machine Model (MM)
= 25°C
Case 751 (SOIC−8) D Suffix
Thermal Resistance, Junction−to−Ambient
Thermal Resistance, Junction−to−Case
Thermal Resistance, Junction−to−Air
Thermal Resistance, Junction−to−Case
Thermal Resistance, Junction−to−Air
Thermal Resistance, Junction−to−Case
Thermal Resistance, Junction−to−Air (with 1.0 oz PCB cu area)
Thermal Resistance, Junction−to−Air (with 1.8 oz PCB cu area)
Thermal Resistance, Junction−to−Case
1
V
MC33275ST
in
2
GND
GND
4
3
V
out
1
V
MC33275DT
in
GND
GND
Rating
4
2
V
out
3
http://onsemi.com
Input
GND
GND
Pins 4 and 5 Not Connected
N/C
PIN CONNECTIONS
1
2
3
4
MC33275D
2
8
7
6
5
Output
GND
GND
N/C
Symbol
psi−JC*
R
R
R
R
R
R
R
R
ESD
V
T
P
T
I
T
qJA
qJC
qJA
qJC
qJA
qJC
qJA
qJA
CC
stg
O
D
A
J
Input
Input
Input
N/C
Ç Ç Ç Ç Ç Ç
Ç Ç
Ç Ç
MC33275MN
1
2
3
4
Internally Limited
− 40 to +125
− 65 to +150
Value
4000
160
245
183
300
150
400
6.0
9.0
13
25
15
92
93
8
7
6
5
Ç Ç Ç
Ç
Ç
Output
N/C
GND
N/C
°C/W
°C/W
°C/W
°C/W
°C/W
°C/W
°C/W
°C/W
°C/W
Unit
Vdc
mA
°C
°C
°C
W
V