SL05T1G ON Semiconductor, SL05T1G Datasheet - Page 2

• Manufacturer Part Number: SL05T1G
• Description: TVS LO CAP 300W 5V ESD SOT23
• Manufacturer: ON Semiconductor

Specifications of SL05T1G

• Voltage - Reverse Standoff (typ): 5V
• Voltage - Breakdown: 6V
• Power (watts): 300W
• Polarization: Bidirectional
• Mounting Type: Surface Mount
• Package / Case: SOT-23-3, TO-236-3, Micro3™, SSD3, SST3
• Applications: General Purpose
• Number Of Circuits: 1
• Voltage - Working: 5V
• Voltage - Clamping: 9.8V
• Technology: Diode Array
• Number Of Elements: 1
• Polarity: Uni-Directional
• Package Type: SOT-23
• Operating Temperature Classification: Military
• Reverse Breakdown Voltage: 6V
• Clamping Voltage: 11V
• Reverse Stand-off Voltage: 5V
• Leakage Current (max): 20uA
• Peak Pulse Current: 17A
• Peak Pulse Power Dissipation: 300W
• Test Current (it): 1mA
• Operating Temp Range: -55C to 150C
• Mounting: Surface Mount
• Pin Count: 3
• Operating Voltage: 5 V
• Breakdown Voltage: 6 V
• Termination Style: SMD/SMT
• Peak Surge Current: 17 A
• Capacitance: 3.5 pF
• Maximum Operating Temperature: + 150 C
• Minimum Operating Temperature: - 55 C
• Dimensions: 1.3 mm W x 2.9 mm L
• Rad Hardened: No
• Diode Type: Unidirectional TVS
• Power Dissipation Pd: 225mW
• Clamping Voltage Vc Max: 11V
• Diode Case Style: SOT-23
• No. Of Pins: 3
• Breakdown Voltage Min: 6V
• Breakdown Voltage Vbr: 9V
• Rohs Compliant: Yes
• Dc: 08+
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Other names: SL05T1GOS; SL05T1GOS; SL05T1GOSTR

Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the
Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect
device reliability.
1. Non−repetitive current pulse per Figure 2
2. FR−5 = 1.0 x 0.75 x 0.62 in.
3. Alumina = 0.4 x 0.3 x 0.024 in., 99.5% alumina
ELECTRICAL CHARACTERISTICS
(T
UNIDIRECTIONAL
MAXIMUM RATINGS
Symbol
Peak Power Dissipation @ 8x20 usec (Note 1)
IEC 61000−4−2
IEC 61000−4−4
IEC 61000−4−5
Total Power Dissipation on FR−5 Board (Note 2) @ T
Thermal Resistance Junction to Ambient
Total Power Dissipation on Alumina Substrate (Note 3) @ T
Thermal Resistance Junction−to−Ambient
Junction and Storage Temperature Range
Lead Solder Temperature − Maximum (10 Second Duration)
A
V
QV
V
Z
Z
= 25°C unless otherwise noted)
I
RWM
I
V
V
@ T
Contact Discharge
Air Discharge
Derate above 25°C
Derate above 25°C
I
PP
I
I
ZK
BR
R
ZT
ZK
T
F
C
F
BR
L
≤ 25°C
Maximum Reverse Peak Pulse Current
Clamping Voltage @ I
Working Peak Reverse Voltage
Maximum Reverse Leakage Current @ V
Breakdown Voltage @ I
Test Current
Maximum Temperature Coefficient of V
Forward Current
Forward Voltage @ I
Maximum Zener Impedance @ I
Reverse Current
Maximum Zener Impedance @ I
Level 4
EFT
Lightning
Parameter
F
PP
T
Rating
ZT
ZK
BR
RWM
A
= 25°C
http://onsemi.com
A
= 25°C
2
V
C
V
BR
V
RWM
Uni−Directional TVS
Symbol
T
°P
R
°P
R
J
P
V
, T
T
qJA
qJA
pp
pk
D
D
L
stg
°
°
I
F
I
I
I
I
R
T
PP
V
F
− 55 to +150
Value
300
±16
225
556
300
417
260
1.8
2.4
±8
40
12
mW/°C
mW/°C
V
°mW°
°C/W
°C/W
°mW
Unit
kV
kV
°C
°C
W
A
A