B72500D160H60 EPCOS Inc, B72500D160H60 Datasheet - Page 15

• Manufacturer Part Number: B72500D160H60
• Description: CERADIODE 16VDC 3PF 0603
• Manufacturer: EPCOS Inc
• Series: CeraDioder

Specifications of B72500D160H60

• Package / Case: 0603 (1608 Metric)
• Varistor Voltage: 65V
• Number Of Circuits: 1
• Maximum Dc Volts: 16VDC
• Polarity: Bidirectional
• Clamping Voltage: 290 V
• Operating Voltage: 16 V
• Breakdown Voltage: 65 V
• Termination Style: SMD/SMT
• Capacitance: 3 pF
• Maximum Operating Temperature: + 85 C
• Minimum Operating Temperature: - 40 C
• Mounting Style: SMD/SMT
• Diode Type: ESD Protection
• Clamping Voltage Vc Max: 290V
• Diode Case Style: 0603
• Operating Temperature Range: -40°C To +85°C
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Energy: -
• Current-surge: -
• Maximum Ac Volts: -
• Lead Free Status / Rohs Status: Lead free / RoHS Compliant
• Other names: 495-3420-2; 495-3686-2; 495-3686-2; B72500D 160H 60; B72500D0160H060; CDS3C16GTH

4
Test
Wettability
Leaching
resistance
Tests of
resistance to
soldering heat
for SMDs
Note:
Leaching of the termination
Effective area at the termination might be lost if the soldering temperature and/or immersion time
are not kept within the recommended conditions. Leaching of the outer electrode should not ex-
ceed 25% of the chip end area (full length of the edge A-B-C-D) and 25% of the length A-B,
shown below as mounted on the substrate.
Please read Cautions and warnings and
Important notes at the end of this document.
CeraDiodes
High-speed series
Solderability tests
As single chip
Standard
IEC
60068-2-58
IEC
60068-2-58
IEC
60068-2-58
Test conditions /
Sn-Pb soldering
Immersion in
60/40 SnPb solder
using non-activated
flux at 215 3 C for
3 0.3 s
Immersion in
60/40 SnPb
solder using
mildly activated flux
without preheating
at 255 5 C
for 10 1 s
Immersion in
60/40 SnPb for 10 s
at 260 C
Page 15 of 22
Test conditions /
Pb-free soldering
Immersion in
Sn96.5Ag3.0Cu0.5
solder using non- or
low activated flux
at 245 5 C
for 3 0.3 s
Immersion in
Sn96.5Ag3.0Cu0.5
solder using non- or
low activated flux
without preheating
at 255 5 C
for 10 1 s
Immersion in
Sn96.5Ag3.0Cu0.5
for 10 s at 260 C
As mounted on substrate
Criteria / test results
Covering of 95%
of end termination,
checked by visual
inspection
No leaching of
contacts
Capacitance change:
15%
C 15%