0900BL18B100E Johanson Technology Inc, 0900BL18B100E Datasheet - Page 53

• Manufacturer Part Number: 0900BL18B100E
• Description: BALUN GSM/DCS/PCS/CDMA 900MHZ
• Manufacturer: Johanson Technology Inc
• Series: 0900r

Specifications of 0900BL18B100E

• Frequency Range: 800 ~ 1000MHz
• Impedance - Unbalanced/balanced: 50 / 100 Ohm
• Phase Difference: 180° ±10
• Insertion Loss (max): 1.0dB
• Return Loss (min): 9.5dB
• Package / Case: 1206 (3216 Metric)
• Mounting Type: Surface Mount
• Impedance - Unbalanced / Balanced: 50ohm To 100ohm
• Insertion Loss: 1dB
• Balun Mounting: Surface Mount (SMD)
• Balun Case Style: 1206 (3216 Metric)
• Rohs Compliant: Yes
• Lead Free Status / RoHS Status: Lead free by exemption / RoHS Compliant
• Other names: 0900BL18B100; 712-1023-2

SLC T
M
E
BOND STRENGTH:
SHEAR STRENGTH:
SOLDER HEAT RESISTANCE:
SOLDERABILITY:
SHOCK:
THERMAL SHOCK:
METALLIZATION TYPE
TERMINATION CODE
ATTACHMENT
COMPATIBILITY
SLC thick-film terminations ( legacy codes “G” and “9”) are still supported. Contact the factory for compatibility information.
NVIRONMENTAL
ETALLIZATION
EMPERATURE
-100%
-20%
-40%
-60%
-80%
0%
C
C
HARACTERISTICS FOR
-35
HARACTERISTICS FOR
C
Exceeds MIL-S-883, Meth. 2011
Exceeds MIL-S-883, Meth. 2019
MIL-S-202, Meth. 210-C, (260±5°C, 5 sec.)
MIL-S-202, Meth. 208, (245±5°C, 5 sec.)
MIL-S-202, Meth. 213-I, (100g, 6 msec.)
MIL-S-202, Meth. 107, A, (-55 to +125°C)
HARACTERISTICS
-25
TiW/Au (Titanium-Tungsten/Gold)
T
Wire / Ribbon Bonding
Silver or Gold Conductive Epoxy
Au/Ge or Au/Si Eutectic Preform
Excellent High Temperature
Resistance (400°C)
Unsuitable for Pb/Sn or Au/Sn Soldering
-15
www.johansontechnology.com
www.johansontechnology.com
-5
GBBL / SLC
GBBL / SLC
5
Temperature (°C)
15
Y (+22% -82%)
Z (+22% -56%)
25
J
VIBRATION:
BURN-IN/LIFE TEST:
LOW VOLTAGE HUMIDITY:
BAROMETRIC PRESSURE:
IMMERSION/SALT SPRAY:
MOISTURE RESISTANCE:
35
TiW/Ni/Au (Titanium-Tungsten/Nickel/Gold)
N
Pb/Sn or Au/Sn Soldering
Au/Sn Eutectic Preform
Moderate High Temp. Resistance (325°C)
Long term high temperature may cause Ni
diffusion and wire bond problems on Au/Ge
45
MIL-S-202, Meth. 204-G, (30g, 10-2000 Hz)
55
65
MIL-S-202, Meth. 108, A/F
Mil-C-49464, Para. 3.17
MIL-S-202, Meth. 105, B
MIL-S-202, Meth. 104, B
MIL-S-202, Meth. 106
75
85
J
53