ATA5575M1330-DDB Atmel, ATA5575M1330-DDB Datasheet - Page 2

• Manufacturer Part Number: ATA5575M1330-DDB
• Description: IC RFID 128BIT 330PF DIE
• Manufacturer: Atmel

Specifications of ATA5575M1330-DDB

• Function: Read/Write
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant

Applications
n A ll Applications Using Unique Format
n A ccess Control ISO Cards, Key Fobs, and Coins
n A sset Management
n M anufacturing and Logistics
Unique Structure
Support Tools
n Application Kit ATA2270-EK1
n Datasheet
n Qual Packs
Ordering Information
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bit 1
Part Number
ATA5575M1ccc-xxx
1)
‘1’
On request
byte 0 to 3
byte 4 to 7
- Material Handling
- Recycling
- Cylinder Tracking
‘1’
‘1’
Digit 0
Digit 1
Digit 2
Digit 3
Digit 4
Digit 5
Digit 6
Digit 7
Digit 8
Digit 9
‘1’
D00 D01 D02 D03
PC0 PC1 PC2 PC3
D10
D20 D21
D30 D31
D40
D50
D60 D61 D62 D63
D70
D80 D81
D90 D91
even column parity bits
‘1’
Capacity
On-Chip
Value pF
250/330
ccc
D11
D41
D51
D71
‘1’
D12
D22 D23
D32 D33
D42
D52 D53
D72
D82 D83
D92 D93
‘1’
Package
D43
D73
D13
‘1’
DDB
DBB
DDW
DDT
DBN
DBQ
-xxx
bit 64
PR0
PR1
PR2
PR3
PR4
PR5
PR6
PR7
PR8
PR9
1)
1)
1)
‘1’
‘0’
1)
Description
6" Sawn Wafer on Foil with Ring, Thickness 150 μm (Approx. 6 mil)
6" Sawn Wafer on Foil with Ring and Au Bumps 25 μm,
Thickness 150 μm (Approx. 6 mil) Plus 25 μm Bumps
6" Wafer, Thickness 280 μm (Approx. 11 mil)
Die in Waffle Pack, Thickness 280 μm (Approx. 11 mil)
Die with Au Bumps 25 μm on Sticky Tape, Thickness 280 μm
(Approx. 11 mil)
Die with Au Bumps 25 μm on Blister Tape, Thickness 280 μm
(Approx. 11 mil)
9 Header
Bits
Memory Mapping
1...............................................................................8
Not transmitted
Configuration Data
User Data
User Data
User Data
User Data
User Data
User Data
User Data
User Data
User Data
User Data
User Data
User Data
User Data
User Data
User Data
User Data
Byte 16
Byte 15
Byte 14
Byte 13
Byte 12
Byte 11
Byte 10
Byte 9
Byte 8
Byte 7
Byte 6
Byte 5
Byte 4
Byte 3
Byte 2
Byte 1
Byte 0
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