TEA6845H/V2,557 NXP Semiconductors, TEA6845H/V2,557 Datasheet - Page 2

• Manufacturer Part Number: TEA6845H/V2,557
• Description: IC CAR RADIO TUNER 64-QFP
• Manufacturer: NXP Semiconductors

Specifications of TEA6845H/V2,557

• Frequency: AM, FM, WB
• Modulation Or Protocol: AM, FM
• Applications: AM/FM Radio Receiver
• Current - Receiving: 78mA
• Data Interface: PCB, Surface Mount
• Antenna Connector: PCB, Surface Mount
• Voltage - Supply: 7.8 V ~ 9.2 V
• Operating Temperature: -40°C ~ 85°C
• Package / Case: 64-QFP
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Features: -
• Sensitivity: -
• Memory Size: -
• Data Rate - Maximum: -
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant, Lead free / RoHS Compliant
• Other names: 935262638557; TEA6845H/V2; TEA6845H/V2

Philips Semiconductors
CONTENTS
1
2
3
4
5
6
7
7.1
7.1.1
7.1.2
7.1.3
7.2
7.2.1
7.2.2
7.2.3
7.2.4
7.2.5
7.3
7.3.1
7.3.2
7.3.3
7.3.4
7.3.5
7.3.6
7.4
8
9
10
11
12
12.1
12.1.1
12.1.2
12.1.3
12.1.4
12.2
12.2.1
12.2.2
12.2.3
12.2.4
12.2.5
12.2.6
12.2.7
12.2.8
13
2003 Feb 04
New In Car Entertainment (NICE) car radio
FEATURES
GENERAL DESCRIPTION
QUICK REFERENCE DATA
ORDERING INFORMATION
BLOCK DIAGRAM
PINNING
FUNCTIONAL DESCRIPTION
Oscillators
VCO
Crystal oscillator
PLL
FM signal channel
DAA
FM I/Q mixer
FM keyed AGC
FM IF amplifiers
FM demodulator
AM signal channel
AM tuner including mixer 1 and mixer 2
AM RF AGC and IF2 AGC
AM detector
AM AF or IF2 switch
AM noise detector and blanker
FM and AM level detector
Test mode
LIMITING VALUES
THERMAL CHARACTERISTICS
DC CHARACTERISTICS
AC CHARACTERISTICS
I
I
Test mode
Data transfer
I
Frequency setting
I
Data transfer mode and IC address
Write mode: data byte 1
Write mode: data byte 2
Write mode: data byte 3
Write mode: data byte 4
Write mode: data byte 5
Write mode: data byte 6
Read mode: data byte 1
TEST AND APPLICATION INFORMATION
2
2
2
2
C-BUS PROTOCOL
C-bus specification
C-bus pull-up resistors
C-bus protocol
2
14
15
15.1
15.2
15.3
15.4
15.5
16
17
18
19
PACKAGE OUTLINE
SOLDERING
Introduction to soldering surface mount
packages
Reflow soldering
Wave soldering
Manual soldering
Suitability of surface mount IC packages for
wave and reflow soldering methods
DATA SHEET STATUS
DEFINITIONS
DISCLAIMERS
PURCHASE OF PHILIPS I
Product specification
2
TEA6845H
C COMPONENTS