MPX4100AP Freescale Semiconductor, MPX4100AP Datasheet - Page 7

SENSOR ABS PRESS 15.2 PSI MAX

MPX4100AP

Manufacturer Part Number
MPX4100AP
Description
SENSOR ABS PRESS 15.2 PSI MAX
Manufacturer
Freescale Semiconductor
Series
MPX4100r
Datasheet

Specifications of MPX4100AP

Pressure Type
Absolute
Operating Pressure
2.9 ~ 15.2 PSI
Port Size
Male, 0.194" (4.9276mm) Tube
Output
0 ~ 4.9V
Voltage - Supply
4.85 V ~ 5.35 V
Termination Style
PCB
Operating Temperature
-40°C ~ 125°C
Package / Case
6-SIP
Mounting Style
Through Hole
Maximum Operating Temperature
+ 125 C
Minimum Operating Temperature
- 40 C
Operating Supply Voltage
5.1 V
Output Voltage
4.87 V to 5.032 V
Operating Pressure Range
20 To 105kPa
Connection Size
4.928mm
Sensitivity, V/p
54mV/kPa
Supply Current
7mA
Sensor Case Style
SIP
No. Of Pins
6
Rohs Compliant
Yes
Lead Free Status / RoHS Status
Lead free / RoHS Compliant

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
MPX4100AP
Manufacturer:
DATEL
Quantity:
392
Sensors
Freescale Semiconductor
the Pressure (P1) side and the Vacuum (P2) side. The
Pressure (P1) side is the side containing fluorosilicone gel,
which protects the die from harsh media. The MPX pressure
design. The footprint for the surface mount packages must be
the correct size to ensure proper solder connection interface
between the board and the package. With the correct
Surface mount board layout is a critical portion of the total
The two sides of the pressure sensor are designated as
MINIMUM RECOMMENDED FOOTPRINT FOR SURFACE MOUNTED APPLICATIONS
INFORMATION FOR USING THE SMALL OUTLINE PACKAGE (CASE 482)
MPX4100A
MPX4100AP
MPX4100AS
MPXAZ4100A6U, MPXA4100A6U/TI
MPXAZ4100AC6U, MPXA4100AC6U
PRESSURE (P1)/VACUUM (P2) SIDE IDENTIFICATION TABLE
0.060 TYP 8X
1.52
Part Number
Figure 5. SOP Footprint (Case 482)
0.100 TYP 8X
2.54
0.660
16.76
Case Type
867B
867E
482A
867
482
sensor is designed to operate with positive differential
pressure applied, P1 > P2.
following table:
footprint, the packages will self align when subjected to a
solder reflow process. It is always recommended to design
boards with a solder mask layer to avoid bridging and
shorting between solder pads.
The Pressure (P1) side may be identified by using the
Stainless Steel Cap
Side with Part Marking
Side with Port Attached
Side with Part Marking
Side with Port Attached
Pressure (P1) Side Identifier
inch
mm
SCALE 2:1
0.100 TYP 8X
2.54
0.300
7.62
Pressure
MPX4100A
7

Related parts for MPX4100AP