ICL3232EIV-16Z-T7A Intersil, ICL3232EIV-16Z-T7A Datasheet - Page 32

• Manufacturer Part Number: ICL3232EIV-16Z-T7A
• Description: IC TXRX RS232 DUAL ESD 16TSSOP
• Manufacturer: Intersil

Specifications of ICL3232EIV-16Z-T7A

• Lead Free Status / RoHS Status: Lead free / RoHS Compliant

Shrink Small Outline Plastic Packages (SSOP)
NOTES:
10. Controlling dimension: MILLIMETER. Converted inch dimensions
N
1
1. Symbols are defined in the “MO Series Symbol List” in Section 2.2
2. Dimensioning and tolerancing per ANSI Y14.5M-1982.
3. Dimension “D” does not include mold flash, protrusions or gate
4. Dimension “E” does not include interlead flash or protrusions.
5. The chamfer on the body is optional. If it is not present, a visual
6. “L” is the length of terminal for soldering to a substrate.
7. “N” is the number of terminal positions.
8. Terminal numbers are shown for reference only.
9. Dimension “B” does not include dambar protrusion. Allowable
0.25(0.010)
of Publication Number 95.
burrs. Mold flash, protrusion and gate burrs shall not exceed
0.20mm (0.0078 inch) per side.
Interlead flash and protrusions shall not exceed 0.20mm (0.0078
inch) per side.
index feature must be located within the crosshatched area.
dambar protrusion shall be 0.13mm (0.005 inch) total in excess of
“B” dimension at maximum material condition.
are not necessarily exact.
2
-A-
INDEX
AREA
3
ICL3221E, ICL3222E, ICL3223E, ICL3232E, ICL3241E, ICL3243E
e
B
D
M
C A
SEATING PLANE
M
E
-C-
-B-
B S
A
32
H
A1
α
0.10(0.004)
0.25(0.010)
GAUGE
PLANE
0.010
A2
0.25
M
B
M
L
C
M28.209
28 LEAD SHRINK SMALL OUTLINE PLASTIC PACKAGE
SYMBOL
A1
A2
C
D
H
N
α
A
B
E
e
L
(JEDEC MO-150-AH ISSUE B)
0.002
0.065
0.009
0.004
0.390
0.197
0.292
0.022
MIN
0°
-
0.026 BSC
INCHES
28
0.078
0.072
0.014
0.009
0.413
0.220
0.322
0.037
MAX
8°
-
0.05
1.65
0.22
0.09
9.90
5.00
7.40
0.55
MILLIMETERS
MIN
0°
-
0.65 BSC
28
10.50
MAX
2.00
1.85
0.38
0.25
5.60
8.20
0.95
8°
-
February 22, 2010
Rev. 2 6/05
FN4910.21
NOTES
9
3
4
6
7
-
-
-
-
-
-
-