NCP2704FCCT1G ON Semiconductor, NCP2704FCCT1G Datasheet - Page 4

• Manufacturer Part Number: NCP2704FCCT1G
• Description: IC SUBSYSTEM AUDIO AMP 20-CSP
• Manufacturer: ON Semiconductor
• Type: Class Dr

Specifications of NCP2704FCCT1G

• Output Type: 1-Channel (Mono) with Stereo Headphones
• Max Output Power X Channels @ Load: 1.7W x 2 @ 4 Ohm; 62mW x 2 @ 16 Ohm
• Voltage - Supply: 2.5 V ~ 5.5 V
• Features: Depop, Differential Inputs, I²C, Shutdown, Thermal Protection, Volume Control
• Mounting Type: Surface Mount
• Package / Case: 20-CSP
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant

Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the
Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect
device reliability.
1. Maximum electrical ratings are defined as those values beyond which damage to the device may occur at T
2. According to JEDEC standard JESD22−A108B.
3. This device series contains ESD protection and passes the following tests:
4. Latch up Current Maximum Rating: $100 mA per JEDEC standard: JESD78 Class II.
5. Moisture Sensitivity Level (MSL): 1 per IPC/JEDEC standard: J−STD−020A.
6. The thermal shutdown set to 160°C (typical) avoids irreversible damage on the device due to power dissipation.
7. The R
Human Body Model (HBM) ESD Rating are (Note 2)
Machine Model (MM) ESD Rating are (Note 2)
MAXIMUM RATINGS
PV
HSV
Other Pins (Note 1)
CSP 2.5 x 2 mm package (Notes 6 and 7)
Operating Ambient Temperature Range
Operating Junction Temperature Range
Maximum Junction Temperature (Note 6)
Storage Temperature Range
Moisture Sensitivity (Note 5)
Human Body Model (HBM) $2.0 kV per JEDEC standard: JESD22−A114 for all pins.
Machine Model (MM) $200 V per JEDEC standard: JESD22−A115 for all pins.
output current and external components selected.
DD
DD
: Power Supply Voltage (Note 1)
R
qCA
(Note 1)
qCA
Thermal Resistance Junction−to−Case
is dependent of the PCB heat dissipation. The maximum power dissipation (PD) is dependent by the min input voltage, the max
+
125 * T
P
D
A
* R
qJC
Rating
http://onsemi.com
4
ESD HBM
ESD MM
Symbol
T
T
R
MSL
V
V
V
JMAX
T
T
STG
qJC
YY
IN
IN
A
J
−0.3 to P
−0.3 to + 6.0
−0.3 to + 4.5
−40 to +125
−65 to +150
−40 to +85
Level 1
Note 7
Value
+150
2000
200
A
VDD
= 25°C.
+ 0.3
°C/W
Unit
°C
°C
°C
°C
V
V
V
V
V