OM6274 NXP Semiconductors, OM6274 Datasheet - Page 19

• Manufacturer Part Number: OM6274
• Description: Interface Modules & Development Tools I2C to SPI Master Bridge Demoboard
• Manufacturer: NXP Semiconductors

Specifications of OM6274

• Interface Type: I2C, SPI
• Data Bus Width: 8 bit
• For Use With/related Products: SC18IS602IPW
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant

NXP Semiconductors
12. Package outline
Fig 23. Package outline SOT403-1 (TSSOP16)
SC18IS602_602B_603_4
Product data sheet
TSSOP16: plastic thin shrink small outline package; 16 leads; body width 4.4 mm
DIMENSIONS (mm are the original dimensions)
Notes
1. Plastic or metal protrusions of 0.15 mm maximum per side are not included.
2. Plastic interlead protrusions of 0.25 mm maximum per side are not included.
UNIT
mm
VERSION
OUTLINE
SOT403-1
max.
1.1
A
0.15
0.05
A
1
16
1
0.95
0.80
A
2
y
IEC
Z
0.25
pin 1 index
A
3
e
D
0.30
0.19
b
p
MO-153
JEDEC
0.2
0.1
c
b
p
REFERENCES
9
8
D
5.1
4.9
0
Rev. 04 — 11 March 2008
(1)
w
E
4.5
4.3
M
(2)
JEITA
scale
0.65
2.5
e
c
A
H
6.6
6.2
2
E
A
1
5 mm
L
1
SC18IS602/602B/603
0.75
0.50
L
H
p
E
E
detail X
0.4
0.3
Q
L
L
PROJECTION
EUROPEAN
p
0.2
v
Q
A
(A )
0.13
3
w
I
2
C-bus to SPI bridge
X
v
0.1
A
© NXP B.V. 2008. All rights reserved.
y
M
ISSUE DATE
A
99-12-27
03-02-18
0.40
0.06
Z
(1)
SOT403-1
8
0
o
o
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