AH1-G TriQuint, AH1-G Datasheet - Page 5

• Manufacturer Part Number: AH1-G
• Description: RF Amplifier 250-4000MHz 13.5dB Gain
• Manufacturer: TriQuint
• Type: Gain Amplifierr

Specifications of AH1-G

• Mounting Style: SMD/SMT
• Number Of Channels: 1
• Operating Frequency: 4000 MHz
• P1db: 21.7 dBm at 800 MHz
• Noise Figure: 3 dB @ 800 MHz
• Operating Supply Voltage: 5 V
• Supply Current: 180 mA @ 5 V
• Maximum Operating Temperature: + 160 C
• Package / Case: SOT-89
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Other names: 1066863

WJ Communications, Inc • Phone 1-800-WJ1-4401 • FAX: [phone] • e-mail: [e-mail] • Web site: www.wj.com, www.TriQuint.com
This package is lead-free/Green/RoHS-compliant. It is compatible with both lead-free (maximum 260 °C reflow temperature) and leaded
AH1-G (Green / Lead-free SOT-89 Package) Mechanical Information
AH1
High Dynamic Range Amplifier
XXXX-X
AH1G
(maximum 245 °C reflow temperature) soldering processes. The plating material on the leads is NiPdAu.
Outline Drawing
Land Pattern
Specifications and information are subject to change without notice.
The AH1-G will be marked with an “AH1G”
designator.
(“XXXX-X”) is also marked below the part
designator on the top surface of the package.
The obsolete tin-lead package is marked with
an “AH1” designator followed by an
alphanumeric lot code.
Tape and reel specifications for this part are
located on the website in the “Application
Notes” section.
ESD Rating: Class 1B
Value:
Test:
Standard:
ESD Rating: Class IV
Value:
Test:
Standard:
MSL Rating: Level 3 at +260 °C convection reflow
Standard:
1. Ground / thermal vias are critical for the proper performance of
2. Add as much copper as possible to inner and outer layers near
3. Mounting screws can be added near the part to fasten the board
4. Do not put solder mask on the backside of the PC board in the
5. RF trace width depends upon the PC board material and
6. Use 1 oz. Copper minimum.
7. All dimensions are in millimeters (inches). Angles are in
Mounting Config. Notes
this device. Vias should use a .35mm (#80 / .0135”) diameter
drill and have a final plated thru diameter of .25 mm (.010”).
the part to ensure optimal thermal performance.
to a heatsink.
contacts the heatsink.
region where the board contacts the heatsink.
construction.
degrees.
MSL / ESD Rating
Product Marking
Passes
Human Body Model (HBM)
JEDEC Standard JESD22-A114
Passes
Charged Device Model (CDM)
JEDEC Standard JESD22-C101
JEDEC Standard J-STD-020
Ensure that the ground / thermal via region
An alphanumeric lot code
500V to <1000V
1000V to <2000V
Page 5 of 5 January 2008