BLM18HK601SN1D Murata, BLM18HK601SN1D Datasheet - Page 5

EMI/RFI Suppressors & Ferrites 600 OHM HIGH FREQ

BLM18HK601SN1D

Manufacturer Part Number
BLM18HK601SN1D
Description
EMI/RFI Suppressors & Ferrites 600 OHM HIGH FREQ
Manufacturer
Murata
Series
BLM18r
Datasheet

Specifications of BLM18HK601SN1D

Shielding
Unshielded
Test Frequency
100 MHz
Product
Chip Ferrite Beads
Impedance
600 Ohms
Tolerance
25 %
Maximum Dc Current
100 mAmps
Maximum Dc Resistance
0.9 Ohms
Operating Temperature Range
- 55 C to + 125 C
Package / Case
0603 (1608 metric)
Termination Style
SMD/SMT
Dc Resistance Max
0.9ohm
Dc Current Rating
100mA
Svhc
No SVHC (15-Dec-2010)
Ferrite Case Style
0603
Core Material
Ferrite
Rohs Compliant
Yes
Ferrite Mounting
SMD
Lead Free Status / RoHS Status
Lead free / RoHS Compliant

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
BLM18HK601SN1D
Manufacturer:
MURATA
Quantity:
240 000
Part Number:
BLM18HK601SN1D
Manufacturer:
MURATA/村田
Quantity:
20 000
I !Caution/Notice
! Note:
1. This datasheet is downloaded from the website of Murata Manufacturing co., ltd. Therefore, it’s specifications are subject to change or our
2. This datasheet has only typical specifications because there is no space for detailed specifications. Therefore, please approve our product
o
!Caution (Rating)
products in it may be discontinued without advance notice. Please check with our sales representatives or product engineers before ordering.
specifications or transact the approval sheet for product specifications before ordering.
Continued from the preceding page.
This data sheet is applied for CHIP FERRITE BEAD used for General Electronics equipment for your design.
Do not use products beyond the rated current and
rated voltage as this may create excessive heat
and deteriorate the insulation resistance.
Noise Suppression Products/EMI Suppression Filters > Chip EMIFILr Inductor Type > for GHz Noise Chip Ferrite Beads
http://www.murata.com/
Data Sheet
Notice
Solderability of Tin plating termination chip might be
deteriorated when low temperature soldering profile
where peak solder temperature is below the Tin melting
point is used. Please confirm the solderability of Tin
plating termination chip before use.
2007.3.8
5

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