STM32F103VFT6 STMicroelectronics, STM32F103VFT6 Datasheet - Page 105

MCU ARM CORTEX MCU 768KB 100LQFP

STM32F103VFT6

Manufacturer Part Number
STM32F103VFT6
Description
MCU ARM CORTEX MCU 768KB 100LQFP
Manufacturer
STMicroelectronics
Series
STM32r
Datasheet

Specifications of STM32F103VFT6

Core Processor
ARM® Cortex-M3™
Core Size
32-Bit
Speed
72MHz
Connectivity
CAN, I²C, IrDA, LIN, SPI, UART/USART, USB
Peripherals
DMA, Motor Control PWM, PDR, POR, PVD, PWM, Temp Sensor, WDT
Number Of I /o
80
Program Memory Size
768KB (768K x 8)
Program Memory Type
FLASH
Ram Size
96K x 8
Voltage - Supply (vcc/vdd)
2 V ~ 3.6 V
Data Converters
A/D 16x12b; D/A 2x12b
Oscillator Type
Internal
Operating Temperature
-40°C ~ 85°C
Package / Case
100-LFQFP
Processor Series
STM32F101xF
Core
ARM Cortex M3
Data Bus Width
32 bit
Data Ram Size
80 KB
Interface Type
I2C, SPI, UART
Maximum Clock Frequency
36 MHz
Number Of Programmable I/os
112
Number Of Timers
15
Operating Supply Voltage
2 V to 3.6 V
Maximum Operating Temperature
+ 85 C
Mounting Style
SMD/SMT
Operating Temperature Range
- 40 C to + 105 C
Processor To Be Evaluated
STM32F103VF
Supply Current (max)
28 mA
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Eeprom Size
-
Lead Free Status / Rohs Status
 Details

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
STM32F103VFT6
Manufacturer:
STMicroelectronics
Quantity:
135
Part Number:
STM32F103VFT6
Manufacturer:
NXP
Quantity:
12 000
Part Number:
STM32F103VFT6
Manufacturer:
STMicroelectronics
Quantity:
10 000
Part Number:
STM32F103VFT6
Manufacturer:
STM
Quantity:
2
Part Number:
STM32F103VFT6
Manufacturer:
ST
0
Part Number:
STM32F103VFT6
Manufacturer:
ST
Quantity:
120
Part Number:
STM32F103VFT6
Manufacturer:
ST
Quantity:
20 000
Part Number:
STM32F103VFT6
0
Part Number:
STM32F103VFT6TR
Manufacturer:
STMicroelectronics
Quantity:
10 000
Part Number:
STM32F103VFT6TR
Manufacturer:
ST
0
STM32F103xF, STM32F103xG
Figure 56. Typical connection diagram using the ADC
1. Refer to
2. C
General PCB design guidelines
Power supply decoupling should be performed as shown in
depending on whether V
ceramic (good quality). They should be placed them as close as possible to the chip.
Figure 57. Power supply and reference decoupling (V
1. V
pad capacitance (roughly 7 pF). A high C
this, f
REF+
parasitic
ADC
V AIN
and V
Table 59
represents the capacitance of the PCB (dependent on soldering and PCB layout quality) plus the
should be reduced.
R AIN (1)
REF–
1 µF // 10 nF
for the values of R
inputs are available only on 100-pin packages.
C parasitic
AINx
REF+
is connected to V
Doc ID 16554 Rev 2
AIN
V DD
1 µF // 10 nF
, R
parasitic
ADC
0.6 V
0.6 V
V T
V T
and C
value will downgrade conversion accuracy. To remedy
ADC
I L ±1 µA
DDA
.
or not. The 10 nF capacitors should be
V
V
STM32F103xx
V
(see note 1)
R ADC (1)
DDA
SSA
Sample and hold ADC
converter
REF+
/V
(see note 1)
REF+
Figure 57
REF–
C ADC (1)
STM32F103xx
not connected to
converter
Electrical characteristics
12-bit
or
Figure
ai14388b
58,
ai14150c
V
DDA
105/120
)

Related parts for STM32F103VFT6