MC56F8257MLH Freescale Semiconductor, MC56F8257MLH Datasheet - Page 52

• Manufacturer Part Number: MC56F8257MLH
• Description: DSC 64K FLASH 60MHZ 64-LQFP
• Manufacturer: Freescale Semiconductor
• Series: 56F8xxxr

Specifications of MC56F8257MLH

• Core Processor: 56800E
• Core Size: 16-Bit
• Speed: 60MHz
• Connectivity: CAN, I²C, LIN, SCI, SPI
• Peripherals: LVD, POR, PWM, WDT
• Number Of I /o: 54
• Program Memory Size: 64KB (32K x 16)
• Program Memory Type: FLASH
• Ram Size: 4K x 16
• Voltage - Supply (vcc/vdd): 3 V ~ 3.6 V
• Data Converters: A/D 16x12b, D/A 1x12b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 105°C
• Package / Case: 64-LQFP
• Product: DSCs
• Processor Series: 56800E
• Core: 56800E
• Device Million Instructions Per Second: 60 MIPs
• Maximum Clock Frequency: 60 MHz
• Number Of Programmable I/os: 54
• Data Ram Size: 8 KB
• Operating Supply Voltage: 3.3 V
• Maximum Operating Temperature: + 105 C
• Mounting Style: SMD/SMT
• Minimum Operating Temperature: - 40 C
• On-chip Adc: 12 bit, 8 Channel
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Eeprom Size: -
• Lead Free Status / Rohs Status: Details

Specifications
7.5
This section contains information about recommended operating conditions.
52
Supply voltage
ADC Reference Voltage High
Voltage difference V
Voltage difference V
Device Clock Frequency
Using relaxation oscillator
Using external clock source
Input Voltage High (digital inputs)
Input Voltage Low (digital inputs)
Oscillator Input Voltage High
XTAL driven by an external clock source
Oscillator Input Voltage Low
DAC Output Load Resistance
DAC Output Load Capacitance
Output Source Current High at V
When programmed for low drive strength
When programmed for high drive strength
Output Source Current Low (at V
When programmed for low drive strength
When programmed for high drive strength
Ambient Operating Temperature
(Extended Industrial)
Flash Endurance
(Program Erase Cycles)
Flash Data Retention
Flash Data Retention with <100
Program/Erase Cycles
Recommended Operating Conditions
Table 22. Recommended Operating Conditions (V
Characteristic
Junction temperature is a function of die size, on-chip power dissipation, package thermal
resistance, mounting site (board) temperature, ambient temperature, air flow, power
dissipation of other components on the board, and board thermal resistance.
See
considerations.
DD
SS
Section 8.1, “Thermal Design
to V
to V
SSA
DDA
MC56F825x/MC56F824x Digital Signal Controller, Rev. 3
OH
OL
max.)
min.)
1
1
FSYSCLK
Symbol
V
V
V
t
V
FLRET
V
REFHx
IHOSC
ILOSC
R
C
V
I
V
I
V
V
T
N
T
DDA
OH
DD,
OL
LD
LD
IH
IL
A
R
DD
SS
F
Considerations,” for more detail on thermal design
Pin Groups 1, 2
Pin Groups 1, 2
Pin Groups 1, 2
Pin Groups 1, 2
T
T
T
J
J
Pin Group 4
Pin Group 4
Pin Group 5
Pin Group 5
Pin Group 1
Pin Group 1
A
<= 85°C avg
<= 85°C avg
= -40°C to
Notes
125°C
REFLx
= 0 V, V
10,000
0.001
Min
-0.1
-0.1
-0.3
-0.3
3.0
2.0
2.0
-40
3K
15
20
—
—
—
—
3
0
SSA
= 0 V, V
Typ
3.3
—
0
0
Freescale Semiconductor
SS
V
= 0 V)
DD
V
Max
400
105
3.6
0.1
0.1
5.5
0.8
0.8
60
60
DDA
—
—
—
-4
-8
4
8
+ 0.3
cycles
years
years
Unit
MHz
mA
mA
°C
pf
V
V
V
V
V
V
V
V