MMA2301EGR2 Freescale Semiconductor, MMA2301EGR2 Datasheet - Page 7

• Manufacturer Part Number: MMA2301EGR2
• Description: IC SENSOR ACCEL +/-200G 16-SOIC
• Manufacturer: Freescale Semiconductor
• Series: MMAr

Specifications of MMA2301EGR2

• Axis: X or Y
• Acceleration Range: ±225g
• Sensitivity: 10mV/g
• Voltage - Supply: 4.75 V ~ 5.25 V
• Output Type: Analog
• Bandwidth: 400Hz
• Mounting Type: Surface Mount
• Package / Case: 16-SOIC (0.300", 7.50mm Width)
• Sensing Axis: X
• Acceleration: 200 g
• Maximum Operating Temperature: + 125 C
• Minimum Operating Temperature: - 40 C
• Mounting Style: SMD/SMT
• No. Of Axes: 1
• Sensor Case Style: SOIC
• No. Of Pins: 16
• Supply Voltage Range: 4.75V To 5.25V
• Operating Temperature Range: -40°C To +125°C
• Acceleration Range ±: 200gf
• Rohs Compliant: Yes
• Package Type: SOIC
• Operating Supply Voltage (min): 4.75V
• Operating Supply Voltage (typ): 5V
• Operating Supply Voltage (max): 5.25V
• Operating Temperature (min): -40C
• Operating Temperature (max): 125C
• Operating Temperature Classification: Automotive
• Product Height (mm): 3.3mm
• Mounting: Surface Mount
• Pin Count: 16
• Lead Free Status / RoHS Status: Lead free by exemption / RoHS Compliant
• Interface: -
• Lead Free Status / Rohs Status: Lead free / RoHS Compliant

Sensors
Freescale Semiconductor
design. The footprint for the surface mount packages must be
the correct size to ensure proper solder connection interface
between the board and the package. With the correct
Surface mount board layout is a critical portion of the total
MINIMUM RECOMMENDED FOOTPRINT FOR SURFACE MOUNTED APPLICATIONS
Figure 6. Footprint SOIC-16 (Case 475-01)
2.03 mm
0.080 in.
9.65 mm
0.380 in.
footprint, the packages will self-align when subjected to a
solder reflow process. It is always recommended to design
boards with a solder mask layer to avoid bridging and
shorting between solder pads.
1.27 mm
0.610 mm
0.050 in.
0.024 in.
MMA2301KEG
7