RX1A23D50MP CARLO GAVAZZI, RX1A23D50MP Datasheet - Page 6

• Manufacturer Part Number: RX1A23D50MP
• Description: SSR, PANEL MOUNT, 265VAC, 32VDC, 50A
• Manufacturer: CARLO GAVAZZI

Specifications of RX1A23D50MP

• Control Voltage Range: 4VDC To 32VDC
• Operating Voltage Range: 24VAC To 265VAC
• Load Current: 50A
• Isolation Voltage: 4000Vrms
• Control Voltage Type: DC
• Relay Terminals: Spring
• Terminal Type: Spring
• Peak Surge Current: 600A
• Contact Configuration: SPST
• Rohs Compliant: Yes

RX1A
Heatsink Dimensions
Derating Curves
6
RX1A...51
50
45
40
35
30
25
20
15
10
5
RX1A...25
25.0
22.5
20.0
17.5
15.0
12.5
10.0
7.5
5.0
2.5
Current (A)
Current (A)
Load
Load
1.88
2.22
2.67
3.27
4.13
5.43
7.63
12.2
26.8
1.6
1.61
2.10
2.73
3.55
4.66
6.24
8.65
12.7
20
20
-
-
Surrounding Ambient temperature (˚C)
Surrounding Ambient temperature (˚C)
Surrounding Ambient temperature (˚C)
Surrounding Ambient temperature (˚C)
1.38
1.62
1.93
2.33
2.86
3.62
4.76
6.71
10.7
23.5
1.30
1.74
2.31
3.05
4.06
5.49
7.67
11.3
18.8
30
30
-
Thermal Resistance
RX1A....H20
RX1A....H21
Thermal Resistance
1.15
1.37
1.63
1.98
2.45
3.11
4.11
9.26
20.2
5.8
0.98
1.38
1.89
2.56
3.46
4.74
6.68
9.97
16.6
40
40
-
(RX assembled to heatsink types RHS23x)
[K/W]
[K/W]
0.93
1.11
1.34
1.64
2.03
3.45
4.89
7.83
11.1
2.6
0.51
0.87
1.33
1.95
2.83
3.98
5.70
8.60
14.5
50
50
-
(load current versus ambient temperature)
0.71
0.86
1.05
1.29
1.62
2.09
3.99
6.42
2.8
0.05
0.33
0.68
1.16
1.83
2.83
4.46
7.23
12.3
14
60
60
-
0.48
0.75
0.95
1.21
1.59
2.15
5.03
0.6
3.1
0.06
0.41
0.89
1.59
2.72
4.79
11
70
9.8
70
Dissipation (W)
-
-
-
Dissipation (W)
Power
Power
48
43
37
32
27
22
17
12
35
30
25
15
10
5
0
40
20
45
8
4
32
28
24
20
17
13
10
7
5
2
20
30
RX1A...50
50
45
40
35
30
25
20
15
10
5
Current (A)
Notes:
1. Device must be mounted on a heatsink or plate with both mounting
screws fastened for correct operation.
2. Thermal resistance values indicated above are valid for assemblies
using thermal paste Electrolube HTS or thermal pad Graftech HT010A,
i.e., Rth
turer should be consulted for selection of appropriate heatsinking.
Specifications are subject to change without notice (28.02.2007)
Load
Surrounding Temperature (Deg. C)
0.99
1.25
1.59
2.04
3.08
4.01
5.42
12.6
7.8
20
cs
-
=0.16K/W. For thermal paste/pads with a higher Rth, manufac-
40
Surrounding Ambient temperature (˚C)
Surrounding Ambient temperature (˚C)
0.74
0.96
1.25
1.63
2.65
3.56
4.84
6.99
11.3
30
-
50
Thermal Resistance
0.49
0.68
0.91
1.22
2.15
4.09
6.18
10.1
2.9
40
-
[K/W]
60
0.25
0.39
1.58
0.82
1.65
2.26
3.22
4.93
19.2
8.8
50
0.11
0.25
0.43
1.16
1.64
2.39
6.57
16.5
70
3.7
60
-
RX1A...50/51..H20
RX1A...25...H20
RX1A...51...H21
RX1A...50...H21
0.04
0.68
1.03
1.58
2.52
4.55
11.8
70
-
-
-
Dissipation (W)
Power
66
58
50
42
35
28
21
15
10
5