PTGL04AS220K4B51A0 Murata Electronics North America, PTGL04AS220K4B51A0 Datasheet - Page 17

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PTGL04AS220K4B51A0

Manufacturer Part Number
PTGL04AS220K4B51A0
Description
THERMISTOR
Manufacturer
Murata Electronics North America
Datasheet

Specifications of PTGL04AS220K4B51A0

Lead Free Status / RoHS Status
Lead free / RoHS Compliant
2
!Note
• This PDF catalog is downloaded from the website of Murata Manufacturing co., ltd. Therefore, it’s specifications are subject to change or our products in it may be discontinued without advance notice. Please check with our
• This PDF catalog has only typical specifications because there is no space for detailed specifications. Therefore, please approve our product specifications or transact the approval sheet for product specifications before ordering.
sales representatives or product engineers before ordering.
!Note
• The Test Condition specification (*1,*2) is applied to the follow P/N.
P/N: NCP15XH103**SR*, NCP15WL233**SR*, NCP15WL333**SR*, NCP15WL473**SR*, NCP15WL683**SR*, NCP15WL104**SR*,
(*1) Resistance(R
(*2) Resisitance(R
16
No. AEC-Q200 Test Item
14
15
16
17
18
19
20
For NTC Thermistors Chip Type Specifications and Test Methods
Continued from the preceding page.
NCP15WL154**SR*, NCP15WB473**SR*, NCP15WF104**SR*, NCP18XH103**SR*,
B-constant(B
B-constant(B
Thermal Shock
ESD
Solderability
Electrical
Characterization
Flammability
Board Flex
Terminal Strengh
(SMD)
• Please read rating and !CAUTION (for storage, operating, rating, soldering, mounting and handling) in this catalog to prevent smoking and/or burning, etc.
• This catalog has only typical specifications because there is no space for detailed specifications. Therefore, please approve our product specifications or transact the approval sheet for product specifications before ordering.
25/50
25/50
25
25
) change should be less than 1%
) change should be less than 5%
) change should be less than 1%
) change should be less than 1%
•Resistance(R
•B-constant(B
•No visible damage.
•Resistance(R
•B-constant(B
•No visible damage.
Minimum 95% of the whole electrode surface
should be covered with solder.
Within the specified tolerance.
(*1)
•Resistance(R
•B-constant(B
•No visible damage.
(*1)
•Resistance(R
•B-constant(B
•No visible damage.
25/50
25/50
25/50
25/50
25
25
25
25
) change should be less than ±5%.
) change should be less than ±5%.
) change should be less than ±5%.
) change should be less than ±5%.
) change should be less than ±2%.
) change should be less than ±2%.
) change should be less than ±2%.
) change should be less than ±2%.
Specifications
N/A
Perform the 300 cycles according to the two heat treatments
listed in the following table. (Maximum transfer time is 20
seconds.)
Measurement at 24±2 hours after test condition.
Per AEC-Q200-004
Per J-STD-002
SMD b) Method B @ 215 °C category 3.
Resistance at 25 °C.
B-constant (B25-50)
Per AEC-Q200-005
Bend the board 2.0mm for 60 seconds.
Use the follow land size.
Per AEC-Q200-006
Apply an *18N force to the side of device for 60 seconds.
Use follow land size.
*5N (NCP15****0SRC)
NCP15****0SRC
NCP18****0SRB
NCP15****0SRC
NCP18****0SRB
Time (min.)
Temp. (°C)
Step
Type
Type
-55+0/-3
AEC-Q200 Test Methods
15±3
0.4
0.6
0.4
1.0
1
a
a
1.2
1.8
1.5
3.0
b
b
125+3/-0
15±3
(in mm)
(in mm)
2
0.5
0.6
0.5
1.2
c
c
b
a
b
a
c
c
R03E.pdf
07.3.21

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