STM32F103RFT6 STMicroelectronics, STM32F103RFT6 Datasheet - Page 104

• Manufacturer Part Number: STM32F103RFT6
• Description: MCU 32BIT 768KB FLASH 64LQFP
• Manufacturer: STMicroelectronics
• Series: STM32r

Specifications of STM32F103RFT6

• Core Processor: ARM® Cortex-M3™
• Core Size: 32-Bit
• Speed: 72MHz
• Connectivity: CAN, I²C, IrDA, LIN, MMC, SPI, UART/USART, USB
• Peripherals: DMA, I²S, LCD, POR, PWM, WDT
• Number Of I /o: 51
• Program Memory Size: 768KB (768K x 8)
• Program Memory Type: FLASH
• Ram Size: 96K x 8
• Voltage - Supply (vcc/vdd): 2 V ~ 3.6 V
• Data Converters: A/D 16x12b, D/A 2x12b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 85°C
• Package / Case: *
• Processor Series: STM32F101xF
• Core: ARM Cortex M3
• Data Bus Width: 32 bit
• Data Ram Size: 80 KB
• Interface Type: I2C, SPI, UART
• Maximum Clock Frequency: 36 MHz
• Number Of Programmable I/os: 112
• Number Of Timers: 15
• Operating Supply Voltage: 2 V to 3.6 V
• Maximum Operating Temperature: + 85 C
• Mounting Style: SMD/SMT
• Operating Temperature Range: - 40 C to + 105 C
• Processor To Be Evaluated: STM32F103RF
• Supply Current (max): 28 mA
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Eeprom Size: -
• Lead Free Status / Rohs Status: Details
• Other names: 497-11114

Electrical characteristics
Figure 55. ADC accuracy characteristics
104/120
4095
4094
4093
7
6
5
4
3
2
1
0
V
SSA
[1LSB
Table 62.
1. ADC DC accuracy values are measured after internal calibration.
2. Better performance could be achieved in restricted V
3. ADC Accuracy vs. Negative Injection Current: Injecting negative current on any of the standard (non-
4. Preliminary values.
1
Symbol
E
O
IDEAL
robust) analog input pins should be avoided as this significantly reduces the accuracy of the conversion
being performed on another analog input. It is recommended to add a Schottky diode (pin to ground) to
standard analog pins which may potentially inject negative current.
Any positive injection current within the limits specified for I
affect the ADC accuracy.
EO
EG
ED
ET
EL
2
=
V
4096
3
REF+
Total unadjusted error
Offset error
Gain error
Differential linearity error
Integral linearity error
ADC accuracy
4
(or
V
5
1 LSB
4096
DDA
Parameter
E
6
T
IDEAL
depending on package)]
E
7
L
(2)
(1) (2)(3)
E
Doc ID 16554 Rev 2
D
4093 4094 4095 4096
(3)
f
f
V
Measurements made after
ADC calibration
PCLK2
ADC
DDA
(1)
= 14 MHz, R
= 2.4 V to 3.6 V
E
= 56 MHz,
Test conditions
G
DD
V
DDA
, frequency, V
INJ(PIN)
(1) Example of an actual transfer curve
(2) The ideal transfer curve
(3) End point correlation line
E
between the actual and the ideal transfer curves.
E
transition and the first ideal one.
E
transition and the last actual one.
E
between actual steps and the ideal one.
E
between any actual transition and the end point
correlation line.
T
O
G
D
L
=Total Unadjusted Error: maximum deviation
=Integral Linearity Error: maximum deviation
=Offset Error: deviation between the first actual
=Gain Error: deviation between the last ideal
=Differential Linearity Error: maximum deviation
AIN
and I
< 10 k,
REF
STM32F103xF, STM32F103xG
INJ(PIN)
and temperature ranges.
in
±1.5
±1.5
±1.5
Typ
±2
±1
Section 5.3.14
Max
±2.5
±3
±2
±5
±3
(4)
does not
ai14395b
Unit
LSB