87783-0001 Molex Inc, 87783-0001 Datasheet - Page 6

CONN SOCKET MINIDIMM 22.5DEG SMD

87783-0001

Manufacturer Part Number
87783-0001
Description
CONN SOCKET MINIDIMM 22.5DEG SMD
Manufacturer
Molex Inc
Series
87783r
Datasheets

Specifications of 87783-0001

Connector Style
MiniDIMM
Number Of Positions
244
Memory Type
DDR 2 SDRAM
Standards
MO-244
Mounting Type
Surface Mount, 22.5° Angle
Features
Board Guide, Latches
Contact Finish
Gold
Contact Finish Thickness
30µin (0.76µm)
Product Type
Mini DIMM
Pitch
0.6 mm
Number Of Positions / Contacts
244
Mounting Style
SMD/SMT
Housing Material
Thermoplastic, High Temperature
Contact Material
Copper Alloy
Contact Plating
Gold
Voltage Rating
30 V
Current Rating
1 A
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Mounting Feature
-
Lead Free Status / Rohs Status
Lead free / RoHS Compliant
Other names
087783-0001
087783-0001-E
0877830001
0877830001-E
87783-0001-E
877830001
877830001-E
WM23939

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
87783-0001
Manufacturer:
MOLEX
Quantity:
34 782
REVISION: ECR/ECN INFORMATION:
DOCUMENT NUMBER:
8.0 OTHER INFORMATIONS
B
8.1 Reflow Profile.
Notes :
PS-87783-001
1. Reflow solder Preheat at 3°C/s to 150°C.
2. Reflow at 250°C for 30s per figure.
3. Peak temperature to be at 260 +0/-5°C
4. Component must withstand (2) reflow solder cycles with a cool down between.
EC No:
DATE:
250°C
S2007-1019
2007/05/17
PRODUCT SPECIFICATION
TITLE:
CREATED / REVISED BY:
CM TEO 2007/05/17
22.5° Angle Mini DIMM, SMT Connector
200/244Ckt, 0.60mm Pitch
YT YANG 2007/05/25
250±5°C
260 +0/-5°C
CHECKED BY:
TEMPLATE FILENAME: PRODUCT_SPEC[SIZE_A4](V.1).DOC
SH LENI 2007/05/25
APPROVED BY:
SHEET No.
6
of
6

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