45560-0160 Molex Inc, 45560-0160 Datasheet - Page 6

• Manufacturer Part Number: 45560-0160
• Description: CONN PLUG CRADLE 16POS VERT SMD
• Manufacturer: Molex Inc
• Series: HandyLink™ 45560r

Specifications of 45560-0160

• Connector Style: Cradle
• Connector Type: Handylink
• Number Of Positions: 16
• Mounting Type: Surface Mount
• Termination: Solder
• Contact Finish: Gold
• Color: Black
• Housing Material: Glass Filled Liquid Crystal Polymer
• Insulation Resistance: 1000 M Ohms
• Mounting Angle: Vertical
• Operating Temperature Range: - 40 C to + 85 C
• Number Of Positions / Contacts: 16
• Pitch: 0.8 mm
• Contact Plating: Gold
• Contact Material: Phosphor Bronze
• Gender: Male
• Current Rating: 1.5 A
• Mounting Style: SMD/SMT
• Termination Style: SMD/SMT
• Pitch Spacing: 0.8mm
• No. Of Rows: 2
• No. Of Contacts: 16
• Contact Termination: Surface Mount Vertical
• Rohs Compliant: Yes
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Features: -
• Contact Finish Thickness: -
• Lead Free Status / Rohs Status: Lead free / RoHS Compliant
• Other names: 045560-0160; 045560-0160-P; 0455600160; 0455600160-P; 45560-0160-P; 455600160; 455600160-P; WM17128TR

REVISION:
DOCUMENT NUMBER:
5.0 SOLDERING PROCESS RECOMMENDATIONS
A
5.1
5.1.1 PCB Layout
See the applicable Sales Drawing for an illustration of the recommended PCB layout.
Contact Molex if further assistance is required.
5.1.2 Solder Paste Stencil Layout
See Sales Drawing for solderable surfaces. Contact Molex if further assistance is required.
5.1.3 Reflow Profile
While the production solder reflow profile is typically established by the customer, based on their
specific application, generic reflow profiles can be found in Product Specification PS-44828-001.
The profiles are provided for reference purposes only.
5.1.4 Inspection
Solder joints should be inspected using established conventional methods.
5.2
5.2.1 PCB Layout
See the applicable Sales Drawings for illustrations of the recommended PCB pad layouts.
Contact Molex if further assistance is required.
5.2.2 Solder Paste Stencil Layout
See Sales Drawing for recommended PCB pad layout and solder paste thickness.
5.2.3 Reflow Profile
While the production solder reflow profile is typically established by the customer, based on their
specific application, generic reflow profiles can be found
The profiles are provided for reference purposes only.
5.2.4 Inspection
Solder joints should be inspected using established conventional methods.
AS-44828-001
ECR/ECN INFORMATION:
EC No:
DATE:
44828 SMT Receptacle Connector
45560 SMT Cradle Connector
6/24/04
UCP2004-2588
APPLICATION SPECIFICATION
PRELIMINARY HANDYLINK™
TITLE:
CREATED / REVISED BY:
T. Gregori/ M. Simmel
HANDYLINK™I/O CONNECTOR SYSTEM
APPLICATION SPECIFICATION
in
Product Specification PS-44828-001.
Marc Simmel
CHECKED BY:
TEMPLATE FILENAME: PRODUCT_SPEC[SIZE_A](V.1).DOC
APPROVED BY:
Joe Comerci
SHEET No.
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