LC03-3.3.T Semtech, LC03-3.3.T Datasheet - Page 4

• Manufacturer Part Number: LC03-3.3.T
• Description: TVS DIODE, 1.8KW, 3.3V, SOIC
• Manufacturer: Semtech

Specifications of LC03-3.3.T

• Diode Type: Low Capacitance
• Clamping Voltage Vc Max: 18V
• Operating Voltage: 3.3V
• Diode Case Style: SOIC
• No. Of Pins: 8
• Peak Pulse Power Ppk @ 8x20us: 1.5kW
• Junction Capacitance: 12pF
• Breakdown Voltage Min: 3.5V
• Capacitance, Cd: 8pF
• Rohs Compliant: Yes
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant

Device Connection Options for Protection of Two
High-Speed Data Lines
The LC03-3.3 is designed to protect two high-speed
data lines (one differential pair) from transient over-
voltages which result from lightning and ESD. The
device can be configured to protect in differential (Line-
to-Line) and common (Line-to-Ground) mode. Data line
inputs/outputs are connected at pins 1 to 8, and 4 to
5 as shown. Pins 2, 3, 6, and 7 are connected to
ground. These pins should be connected directly to a
ground plane on the board for best results. The path
length is kept as short as possible to minimize parasitic
inductance. In applications where high common mode
voltages are present, differential protection is achieved
by leaving pins 2, 3, 6, and 7 not connected.
PROTECTION PRODUCTS
Applications Information
Connection for Differential (Line-to-Line) and Com-
2008 Semtech Corp.
mon Mode Protection (Line-to-Ground)
Connection for Differential Protection
(Line-to-Line)
4
Matte Tin Lead Finish
Matte tin has become the industry standard lead-free
replacement for SnPb lead finishes. A matte tin finish
is composed of 100% tin solder with large grains.
Since the solder volume on the leads is small com-
pared to the solder paste volume that is placed on the
land pattern of the PCB, the reflow profile will be
determined by the requirements of the solder paste.
Therefore, these devices are compatible with both
lead-free and SnPb assembly techniques. In addition,
unlike other lead-free compositions, matte tin does not
have any added alloys that can cause degradation of
the solder joint.
PRELIMINARY
LC03-3.3
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