HPND-0002 Avago Technologies US Inc., HPND-0002 Datasheet

HPND-0002

Manufacturer Part Number

HPND-0002

Description

RF DIODE, PIN, 0.2PF, 100V, CHIP

Manufacturer

Avago Technologies US Inc.

Datasheet

1.HPND-0002.pdf (2 pages)

Specifications of HPND-0002

Capacitance Cd Max @ Vr F

0.2pF

Resistance @ If

3.5ohm

Forward Current If(av)

100mA

Operating Temperature Range

-65Â°C To +150Â°C

Series Resistance @ If

305ohm

Diode Type

RF Pin

Function

Diode

Configuration

Single

Power Dissipation

250mW

Operating Temperature Classification

Military

Reverse Voltage

100V

Operating Temperature (max)

150C

Operating Temperature (min)

-65C

Pin Count

Breakdown Voltage

100V

Package / Case

Chip

Rohs Compliant

Yes

Lead Free Status / RoHS Status

Lead free / RoHS Compliant

Lead Free Status / RoHS Status

Lead free / RoHS Compliant, Lead free / RoHS Compliant

Available stocks

Company

Part Number

Manufacturer

Quantity

Price

Company:

Bonase Electronics (HK) Co., Limited

Part Number:

HPND-0002

Manufacturer:

AVAGO

Quantity:

40 000

Company:

Meier Automation Equipment Co., Limited

Part Number:

HPND-0002

Manufacturer:

AVAGO/安华高

Quantity:

20 000

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Download datasheet (73Kb)

Small Signal RF PIN Diode Chips for Hybrid Integrated Circuits

Data Sheet

Description

These PIN/NIP diode chips are specifically designed for

hybrid applications requiring thermosonic or thermo-

compression bonding techniques. The top metallization

is a layer of gold for a tarnish free surface that allows ei-

ther thermosonic or thermocompression bonding tech-

niques. The bottom metallization is also gold, suitable

for epoxy or eutectic die attach method.

Applications

These small signal, general purpose PIN/NIP diode chips

are optimized for various analog and digital applications

such as switches, digital phase shifters, pulse and ampli-

tude modulators, limiters, leveling, and attenuating.

HPND-0002 Chip Dimensions

DIMENSIONS IN MILLIMETERS

(1/1000 INCH).

TOP CONTACT

DIMENSIONS

(0.03)

(0.05)

(0.03)

CONTACT

BOTTOM

(1)

(2)

(1)

ATTACH PART NO.

FOR EPOXY OR

EUTECTIC DIE

HPND-0002

CATHODE

ANODE

0.20

0.38

0.20

(15)

(8)

Features

• Thermocompression/Thermosonically Bondable

• Ideal for Hybrid Integrated Circuits

• Gold Metallization

• Silicon Nitride Passivation

• Uniform Electrical Characteristics

• Batch Matched Versions Available

• Planar Construction

Maximum Ratings

Junction Operating and Storage Temperature Range:

PD Power Dissipation: 250 mW

(Measured in an infinite heat sink derated linearly to

zero at 150°C.)

Operation in excess of any one of these conditions may

result in permanent damage to this device.

-65°C to +150°C

= 25°C

Related parts for HPND-0002

HPND-0002 Summary of contents

Page 1

... Applications These small signal, general purpose PIN/NIP diode chips are optimized for various analog and digital applications such as switches, digital phase shifters, pulse and ampli- tude modulators, limiters, leveling, and attenuating. HPND-0002 Chip Dimensions D DIMENSIONS X D (0.03 ...

Page 2

... This method is recom- mended for HPND-0002. b. Epoxy For epoxy die-attach, conductive silver-filled epoxies are recommended. This method can be used for all Avago Technologies’ ...

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