04023J0R2ABSTR AVX Corporation, 04023J0R2ABSTR Datasheet - Page 19
![CAPACITOR, ACCU-P 0.2PF 25V 0402CAPACITOR, ACCU-P 0.2PF 25V 0402](/photos/25/85/258512/756873804-40_sml.jpg)
04023J0R2ABSTR
Manufacturer Part Number
04023J0R2ABSTR
Description
CAPACITOR, ACCU-P 0.2PF 25V 0402CAPACITOR, ACCU-P 0.2PF 25V 0402
Manufacturer
AVX Corporation
Series
ACCUPr
Datasheet
1.04023J0R2ABSTR.pdf
(20 pages)
Specifications of 04023J0R2ABSTR
Capacitance
0.2PF
Voltage Rating, Dc
25V
Capacitor Dielectric Type
CERAMIC MULTI-LAYER
Tolerance,
25%
Tolerance, -
25%
Temp, Op. Max
125(DEGREE
Rohs Compliant
YES
Tolerance
0.05 pF
Voltage Rating
25 Volts
Operating Temperature Range
- 55 C to + 125 C
Temperature Coefficient / Code
C0G (NP0)
Package / Case
0402 (1005 metric)
Product
RF Microwave MLCCs
Dimensions
0.022 in W x 0.039 in L x 0.016 in H
Termination Style
SMD/SMT
Lead Free Status / Rohs Status
Details
Accu-F
Application Notes
PREHEAT & SOLDERING
The rate of preheat in production should not exceed 4°C/
second and a recommended maximum is about 2°C/second.
Temperature differential from preheat to soldering should not
exceed 100°C.
For further specific application or process advice, please consult
AVX.
COOLING
After soldering, the assembly should preferably be allowed
to cool naturally. In the event of assisted cooling, similar
conditions to those recommended for preheating should be
used.
HAND SOLDERING & REWORK
Hand soldering is permissible. Preheat of the PCB to 150°C is
required. The most preferable technique is to use hot air sol-
dering tools. Where a soldering iron is used, a temperature
controlled model not exceeding 30 watts should be used and
set to not more than 260°C.
RECOMMENDED SOLDERING
PROFILE
IR REFLOW
220
210
200
190
180
170
160
150
140
130
120
110
100
90
80
70
60
50
40
30
20
0
Assembly enters the
preheat zone
0.5
1
Soak time
1) Activates the flux
2) Allows center of board
temperatures to catch up with
corners
®
Additional soak time
to allow uniform
heating of the
substrate
1.5
/ Accu-P
VAPOR PHASE
2
215°C
Time (mins)
200
180
160
140
120
100
80
60
40
20
2.5
0
Preheat
45-60 sec.
above solder
melting point
3
3.5
Assembly exits heat–
no forced cooldown
Time (minutes)
4
186°C solder melting
temperature
®
4.5
CLEANING RECOMMENDATIONS
Care should be taken to ensure that the devices are
thoroughly cleaned of flux residues, especially the space
beneath the device. Such residues may otherwise become
conductive and effectively offer a lossy bypass to the device.
Various recommended cleaning conditions (which must be
optimized for the flux system being used) are as follows:
STORAGE CONDITIONS
Recommended storage conditions for Accu-F
Accu-P
Cleaning liquids. . . . . . . i-propanol, ethanol, acetylacetone,
Ultrasonic conditions . . power-20w/liter max.
Temperature . . . . . . . . . 80°C maximum (if not otherwise
Time . . . . . . . . . . . . . . . 5 minutes max.
WAVE SOLDERING
Temperature . . . . . . . . . . 15°C to 35°C
Humidity . . . . . . . . . . . . . ≤65%
Air Pressure . . . . . . . . . . 860mbar to 1060mbar
260
240
220
200
180
160
140
120
100
Transfer from
preheat with
min. delay &
temp. loss
80
60
40
20
®
0
prior to use are as follows:
10
215°C
200
180
160
140
120
100
80
60
40
20
20
0
Enter
Vapor
Duration varies
with thermal mass
of assembly
10–60 secs typical
30
10
Reflow
100°C
20
40
water and other standard PCB
cleaning liquids.
frequency-20kHz to 45kHz.
limited by chosen solvent system).
30
Time (seconds)
50
40
60
Time (seconds)
50
Natural
Cooling
70
60
80
70
90
100
Enter Wave
3–5 seconds
110
®
120
Natural
Cooling
and
23
1