UPG2418TB-A CEL, UPG2418TB-A Datasheet - Page 9

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UPG2418TB-A

Manufacturer Part Number
UPG2418TB-A
Description
IC SW SPDT 0.5-3.0GHZ 6-MINIMOLD
Manufacturer
CEL
Datasheet

Specifications of UPG2418TB-A

Rf Type
Bluetooth, WLAN
Frequency
50MHz ~ 3GHz
Features
SPDT
Package / Case
*
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Infrared Reflow
Wave Soldering
Partial Heating
μ
RECOMMENDED SOLDERING CONDITIONS
This product should be soldered and mounted under the following recommended conditions. For soldering methods and
conditions other than those recommended below, contact your nearby sales office.
Do not use different soldering methods together (except for partial heating).
R09DS0007EJ0100 Rev.1.00
Aug 24, 2010
PG2418TB
Soldering Method
Peak temperature (package surface temperature) : 260°C or below
Time at peak temperature
Time at temperature of 220°C or higher
Preheating time at 120 to 180°C
Maximum number of reflow processes
Maximum chlorine content of rosin flux (% mass) : 0.2%(Wt.) or below
Peak temperature (molten solder temperature)
Time at peak temperature
Preheating temperature (package surface temperature) : 120°C or below
Maximum number of flow processes
Maximum chlorine content of rosin flux (% mass) : 0.2%(Wt.) or below
Peak temperature (terminal temperature)
Soldering time (per side of device)
Maximum chlorine content of rosin flux (% mass) : 0.2%(Wt.) or below
Soldering Conditions
CAUTION
: 10 seconds or less
: 60 seconds or less
: 120±30 seconds
: 3 times
: 260°C or below
: 10 seconds or less
: 1 time
: 350°C or below
: 3 seconds or less
Condition Symbol
WS260
HS350
IR260
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