KGM1206VCTTE2222A KOA Speer Electronics, KGM1206VCTTE2222A Datasheet - Page 3

• Manufacturer Part Number: KGM1206VCTTE2222A
• Manufacturer: KOA Speer Electronics

Specifications of KGM1206VCTTE2222A

• Operating Temp Range: -55C to 125C
• Mounting Style: Surface Mount
• Package / Case: 1206
• Construction: SMT Chip
• Lead Spacing (nom): Not Requiredmm
• Product Diameter (mm): Not Requiredmm
• Product Depth (mm): 1.6mm
• Product Length (mm): 3.2mm
• Lead Free Status / RoHS Status: Compliant

environmental applications (continued)
Performance Characteristics
* After temperature cycle test, high temperature resistance test, humidity resistance test or low temperature resistance test, the tested sample
Specifications given herein may be changed at any time without prior notice. Please confirm technical specifications before you order and/or use.
KOA Speer Electronics, Inc. • Bolivar Drive • P .O. Box 547 • Bradford, PA 16701 • USA • 814-362-5536 • Fax: [phone] • www.koaspeer.com
Terminal Adhesion Strength
Resistance to Solder Heat
Solderability
Temperature Cycle*
High Temperature
Resistance*
Humidity Resistance
(Unload)*
Substrate Bending Test
Humidity Resistance
(Load)*
Low Temperature
Resistance
(Unload)*
Vibration
should be measured after having been left in temperature from 15°C to 35°C and relative humidity from 45% to 75% for 24 hours.
Parameter
No physical damage
Appearance: No physical damage
Capacitance: Within tolerance
Dielectric Loss: Within tolerance
Insulation Resistance: Within tolerance
More than 95% of the terminal electrode
shall be covered with new solder
Appearance: No physical damage
Capacitance: Within tolerance
Dielectric Loss: Within tolerance
Insulation Resistance: Within tolerance
Appearance: No physical damage
Capacitance: Within tolerance
Dielectric Loss: Within tolerance
Insulation Resistance: Within tolerance
Appearance: No physical damage
Capacitance: Within tolerance
Dielectric Loss: Within tolerance
Insulation Resistance: Within tolerance
Appearance: No physical damage
Capacitance: Within tolerance
Appearance: No physical damage
Capacitance: Within tolerance
Dielectric Loss: Within tolerance
Insulation Resistance: Within tolerance
Appearance: No physical damage
Capacitance: Within tolerance
Dielectric Loss: Within tolerance
Insulation Resistance: Within tolerance
Appearance: No physical damage
Capacitance: Within tolerance
Dielectric Loss: Within tolerance
Insulation Resistance: Within tolerance
Requirement
three-terminal capacitor
Solder a chip to a test
substrate and then
laterally apply a
load (5N, 500gF) in
the arrow direction
Flux: 25% rosin Preheating: 60 seconds
Preheating Temperature: 150°C
Solder: H60A
Solder Temperature: 260°C ±5°C
Dip Time: 5 seconds ± 0.5 second
Flux: 25% rosin Preheating: 60 seconds
Preheating Temperature: 150°C
Solder: H60A
Solder Temperature: 230°C ±5°C
Dip Time: 4 seconds ± 1 second
Repeat the following heat cycle 10 times:
Step:
Temperature: 70°C ± 2°C
Bias: 150% of rated voltage
Test Time: 1000 +48/-0 hours
Temperature: 85°C ± 2°C
Humidity: 85% ± 5%
Test Time: 500 +24/-0 hours
After soldering a chip to a test
substrate, bend the substrate
by 1 mm and then measure.
The substrate is GE4 or
based on GE4.
Temperature: 40°C ± 2°C
Humidity: 90 - 95%
Bias: 100% of rated voltage
Test Time: 500 +24/-0 hours
Temperature: -40°C ± 2°C
Test Time: 1000 +48/-0 hours
The frequency of applied vibration should be swept
from 10 Hz to 55 Hz and return to 10 Hz. This cycle
time should be about 1 minute and this cycle should
be repeated.
Amplitude (Total Excursion): 1.5 mm
This motion shall be applied for a period of 2 hours in
each of 3 mutually perpendicular axes (total of 6 hours).
1
2
3
4
Temperature:
-40°C ± 3°C
Room Temp.
85°C ± 2°C
Room Temp.
Test Method
KGM
Substrate
Time:
30 minutes ± 3 minutes
15 minutes maximum
30 minutes ± 3 minutes
15 minutes maximum
Substrate
45 ± 2
Chip
20
3/05/07
45 ± 2
Weight
Displacement
275