B32561J1105J EPCOS Inc, B32561J1105J Datasheet - Page 26

• Manufacturer Part Number: B32561J1105J
• Manufacturer: EPCOS Inc

Specifications of B32561J1105J

• Lead Free Status / RoHS Status: Compliant

3
In many applications, finished circuit assemblies are embedded in plastic resins. In this case,
both chemical and thermal influences of the embedding ("potting") and curing processes must be
taken into account.
Our experience has shown that the following potting materials can be recommended: non-flexible
epoxy resins with acid-anhydride hardeners; chemically inert, non-conducting fillers; maximum
curing temperature of 100 C.
Caution:
Consult us first if you wish to embed uncoated types!
Please read Cautions and warnings and
Important notes at the end of this document.
Embedding of capacitors in finished assemblies
B32560 ... B32564
General purpose (stacked) SilverCap
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