NCP21WB333K03RA Murata, NCP21WB333K03RA Datasheet - Page 19

• Manufacturer Part Number: NCP21WB333K03RA
• Description: Thermistors - NTC 33K OHM 10%
• Manufacturer: Murata
• Type: NTCr
• Series: NCPr

Specifications of NCP21WB333K03RA

• Description Of Terminals: Leadless
• Mounting Style: Surface Mount
• Pin Count: 2
• Screening Level: Automotive
• Resistance @ 25c: 33kohm
• Percentage Of Resistance Tolerance @ 25c: ±10
• Accuracy: ±3
• Operating Temperature Min Deg. C: -40C
• Operating Temperature Max Deg. C: 125C
• Product Length (mm): 2mm
• Product Depth (mm): 1.25mm
• Resistance: 33 KOhms
• Tolerance: 10 %
• Operating Temperature Range: - 40 C to + 125 C
• Package / Case: 0805
• Current Rating: 0.24 mAmp
• Power Rating: 200 mW
• Lead Free Status / RoHS Status: Compliant

4
!Note
!Note
1. Mounting Position
2. Reflow Soldering Conditions
3. Flow Soldering Conditions
1
18
Chip Type !Caution/Notice
Notice (Soldering and Mounting)
Choose a mounting position that minimizes the stress
imposed on the chip during flexing or bending of the
board.
(NCP03/NCP15 Series)
(NCP18/NCP21 Series)
(NCP18/NCP21 Series)
Allowable Reflow Soldering Temperature and Time
Allowable Reflow Soldering Temperature and Time
• Please read rating and !CAUTION (for storage, operating, rating, soldering, mounting and handling) in this catalog to prevent smoking and/or burning, etc.
• This catalog has only typical specifications because there is no space for detailed specifications. Therefore, please approve our product specifications or transact the approval sheet for product specifications before ordering.
Please read rating and !CAUTION (for storage, operating, rating, soldering, mounting and handling) in this PDF catalog to prevent smoking and/or burning, etc.
This catalog has only typical specifications. Therefore, you are requested to approve our product specifications or to transact the approval sheet for product specificaions before ordering.
Allowable Flow Soldering Temperature and Time
280
270
260
250
240
230
220
280
270
260
250
240
230
220
210
0
0
10
10
280
270
260
250
240
230
220
210
20 30 40 50 60 70
0
20 30 40 50 60 70 80
Time (sec.)
Time (sec.)
Time (sec.)
10
20
80
30
90
100
110
90
[Component Direction]
[Mounting Close to Board Separation Line]
300
200
100
300
200
100
300
200
100
Perforation
Holes
0
0
0
Standard Soldering Conditions
Standard Soldering Conditions
Preheating : 160 10 C, 1-2 min.
Soldering : 240-270 C, 20sec. max.
Preheating : 160 10 C, 1-2 min.
Soldering : 230-270 C, 20sec. max.
Standard Soldering Conditions
Preheating : 160 10 C, 1-2 min.
Soldering : 230-260 C, 10sec. max.
A
Preheating (in air)
Preheating (in air)
Preheating (in air)
Slit
B
1-2 min.
1-2 min.
1-2 min.
D
C
Soldering
20sec. max.
Soldering
Soldering
10sec. max.
20sec. max.
Continued on the following page.
Keep this product on the
PC Board away from the
Separation Line.
Worst
Gradual Cooling
Gradual Cooling
Gradual Cooling
(in air)
(in air)
(in air)
A-C-B-D
R44E9.pdf 05.4.13
Locate this
product
horizontal to the
direction in
which stress
acts.
Better